No need for labor-intensive processes, solvents, or removal of residual adhesives! A reusable and SDGs-friendly UV-curable temporary adhesive!
The conventional representative temporary adhesives involve heating and dissolving low melting point hot melt resins, such as wax or rosin, to bond them to the substrate, followed by processing after cooling. During peeling, the resin is re-melted by heating and removed, while the resin remaining on the substrate is cleaned using washing solvents such as warm water or alkaline solutions. Another common method involves using a cleaning solvent to dissolve and peel off temporary adhesives that have been cured by UV or heat. The new type developed by our company is a temporary adhesive that, after bonding the substrate through UV curing, incorporates a thermal history of approximately 200°C for 1 to 10 minutes, allowing for a decrease in adhesive strength at room temperature and enabling peeling. Unlike thermoplastic resins, this adhesive's strength decreases due to thermal history, allowing it to withstand heat environments of around 120°C for 1 hour or 160°C for about 10 minutes. *For more details, please download the catalog or contact us.*
Inquire About This Product
basic information
It is possible to peel off the substrate after returning it to room temperature! By heating the cured adhesive layer and returning the substrate to room temperature during heating, changes occur at the adhesive interface (peeling phenomenon), causing a rapid decrease in adhesive strength. In the case of adhesion between glass substrates, both substrates will peel off from the interface, allowing the resin layer to peel off cleanly in a film-like manner. Depending on the condition of the substrate, a cleaning process may not be necessary. *For more details, please download the catalog or contact us.*
Price range
Delivery Time
Applications/Examples of results
For more details, please contact us.
catalog（1）
Download All Catalogs
Company information
■ Manufacturing and sales of laser equipment and its application devices and parts, as well as import and export operations ■ Manufacturing and sales of electrical and electronic equipment and its application devices and parts, as well as import and export operations ■ Sales of optical equipment and its application devices and parts, as well as import and export operations ■ Manufacturing and sales of medical, physical, and measuring instruments and their application devices and parts, as well as import and export operations ■ Manufacturing and sales of adhesives, adhesive tapes, adhesive sheets, and their equipment and devices, as well as import and export operations ■ All operations incidental to the above items
![[Web Seminar] Principles and Applications of High-Speed Optical Modulators](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280)
