InnoLas laser marking device for wafers
(FOUP type) IL C2000 and IL C3000: Please refer to the lineup below.
The laser light source developed by InnoLas for wafer marking achieves a low running cost that can be maintained for about 10 years (based on actual data).
Markable wafer materials: Silicon (Si), Germanium (Ge), Sapphire (Al2O3), Lithium Tantalate (LiTaO3), Lithium Niobate (LiNbO3), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Silicon Carbide (SiC), Indium Phosphide (InP), glass, etc. To accommodate various wafer materials, we offer the following lasers: - UV (355nm), Green (532nm), IR (1064nm), IR, Carbon Dioxide (10.6μm). Options: - Motorized Beam Expander (MBE): Adjusts beam diameter, focal position, etc., according to recipe data. - Power Consumption Display Panel (DCM): Aggregates and displays line power supply, Galvo voltage/temperature, compressed air pressure, etc., in one location. - Additionally, we offer a variety of user-friendly options.
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basic information
Soft Mark Hard Mark - Dot formation principle Melted Evaporation - Diameter 55–70μm 85–110μm - Depth 0.5–4μm 5–100μm Throughput and corresponding wafer sizes by model: - IL 1000 100 pieces/hour Size: 2”, 2.25”, 3”, 3.25”, 100, 125, 150, 200mm - IL 2000 200 pieces/hour Size: 2”, 2.25”, 3”, 3.25”, 100, 125, 150, 200mm - IL 3000 160 pieces/hour Size: 300mm - IL C3000 120 pieces/hour Size: 300mm * The above throughput is based on the following condition: "When printing 12 characters in double density at a font size of 10 x 18."
Price range
Delivery Time
Applications/Examples of results
Domestic major wafer manufacturers and device manufacturers have a proven track record.
Detailed information
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FOUP type: Compatible with OHT, AGV, PGV Device dimensions: W2,092 x D1,648 x H2,196 Weight: 1,500kg Power consumption: 2,000W Handling: Edge grip handling Double arm (HT specification)
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Open cassette type: Device dimensions: W2,003 x D1,425 x H1,819 Weight: 1,200kg Power consumption: 1,500W Handling: Vacuum handling Single arm
Line up（6）
| Model number | overview |
|---|---|
| IL 600 | A budget wafer marking device that allows for manual wafer loading. Suitable for research and development. |
| IL 1000 | A wafer marking device for small lot production of various types. Compatible with wafer sizes up to 200 mm. Open cassette type. |
| IL 2000 | A mass production wafer marking device for 200 mm wafers. Open cassette type. |
| IL 3000 | A mass production wafer marking device for 300 mm wafers. Open cassette type. |
| IL C2000 | A mass production wafer marking device for 200 mm wafers. FOUP type. |
| IL C3000 | A mass production wafer marking device for 300 mm wafers. FOUP type. |
Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
![[Application Examples] Jewelry Manufacturing and Watch Manufacturing - Cutting, Welding, Marking](https://image.mono.ipros.com/public/product/image/933/2000866162/IPROS20058625889895377559.jpeg?w=280&h=280)
![Free test campaign for laser marking underway [with benefits!]](https://image.mono.ipros.com/public/product/image/452/2000507011/IPROS45067608240422863008.gif?w=280&h=280)
