There are no restrictions on the shape of the plating target, and the uniformity is good! The main components are metal salts and reducing agents.
"Electroless plating" is a method that causes a chemical reduction reaction in a solution, resulting in the deposition of plating metal onto materials or components. It has advantages such as no restrictions on the shape of the plating target and good uniformity, and the corrosion resistance of electroless nickel is superior to that of electrolytic nickel. Electroless copper plating is used for reduction plating, replacement plating, and conductive treatment of insulating resin (plastic) surfaces. [Components] ■ Main components: Metal salts, reducing agents ■ Auxiliary components: pH adjusters, buffers, complexing agents, accelerators, stabilizers, modifiers *For more details, please download the PDF or feel free to contact us.
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【Types (Partial)】 ■Electroless Copper Plating ■Electroless Nickel Plating ■Electroless Tin Plating ■Electroless Gold Plating ■Electroless Palladium Plating ■Electroless Silver Plating *For more details, please download the PDF or feel free to contact us.
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Our company performs plating processes for chip resistors, connectors, and ceramic substrates for LEDs. As a result of our aim to be a trusted and necessary company that responds to any changes in our customers' needs, we receive requests for world-class products. From the field of surface treatment, we strive to be a company that supports the electronic components industry, including automotive and semiconductors, prioritizing the trust of our customers, maintaining a spirit of challenge, and working hard to continue growing.