立山電化工業 Company Overview

A section without gold plating (exposed nickel plating) is provided, and the thickness of the gold-plated section can be adjusted vertically! Additionally, technical materials related to surface treatment are also available!

When you look inside mobile phones and smartphones, you will find ultra-low-profile narrow-pitch connectors that have partial gold plating on their terminals. "Hoop plating" is a plating method suitable for connector components that connect electronic circuits. It realizes advanced technology that applies a "nickel barrier" to prevent solder wicking during assembly. 【Features】 ■ In the partial plating reel-to-reel line, stripe Au plating and spot Au plating are possible. ■ It supports specifications that combine two types of plating, such as partial Sn plating and partial Au plating, and can propose cost reductions by changing specifications from partial Au plating to partial Sn plating. ■ Our unique special drum and inline laser stripping technology enable the formation of a more precise "nickel barrier" through partial plating. ■ In the reel-to-reel line for full plating, base Ni plating followed by Sn plating is possible. ■ Both Au plating and Sn plating lines can accommodate SUS materials. ■ Supports reflow processing for Sn plating. *Some specifications may have restrictions. ■ Certified to IATF 16949. *For more details, please refer to the PDF document or feel free to contact us.