CAM joining technology that enables dissimilar material bonding with low thermal resistance - Technical documentation available.
Joining of dissimilar materials such as metals, resins, and ceramics is possible! Improving thermal dissipation characteristics is becoming increasingly important. The bonding strength is secured at over 10 MPa in shear tensile tests.
Our company conducts trial processing, specialized CAM agents, and process development using CAM bonding technology. This bonding technology combines chemical bonding and fusion. It is environmentally friendly, allows for easy construction, and can reduce costs. CAM agents are applied and dried on metal surfaces to form an organic film, and the bonded materials are joined through thermal press bonding. You can read technical documents that describe detailed features and functions. 【Examples of Bondable Materials】 ■ Metals: Aluminum, Copper, Steel, Titanium ■ Resins: Nylon, PBT, CFRP ■ Ceramics: Alumina, Glass ■ Zero thermal resistance is also possible.
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【Features of Low Thermal Resistance CAM Agents】 ■M8.xx: Water-soluble, conductive ■G4.xx: Non-water-soluble, insulating, transparent ■Q1.xx: Non-water-soluble, conductive ■Q3.xx: Non-water-soluble, insulating ■Q5.xx: Non-water-soluble, insulating, inexpensive *For more details, please feel free to contact us.
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Our company is engaged in the development of joining technologies. The newly developed CAM joining can handle a range of applications, starting from the joining of dissimilar materials such as metal and resin, to metal-metal joining that includes dissimilar metals. CAM joining can achieve zero thermal resistance and is also applicable to the laminated joining of multilayer thin plates.