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  6. Silver-plated conductive material TOYAL TecFiller TFM series

Silver-plated conductive material TOYAL TecFiller TFM series

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last updated:Feb 17, 2025

東洋アルミニウム
東洋アルミニウム
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Achieve cost reduction! Fillers for conductive inks and conductive adhesives made with excellent conductivity.

TOYAL TecFiller is a unique functional filler that can impart properties such as conductivity, thermal conductivity, and insulation. Among them, the TFM series features a silver plating on the surface of relatively inexpensive core materials. As a result, it contributes to reducing costs and migration in your products compared to 100% Ag (silver) fillers. The TFM series is intended for use as a filler (filling agent) in conductive inks and conductive adhesives. 【Features】 - Uniform plating on individual particles - High conductivity performance - Core materials can be metal (copper powder) or ceramics (silicon oxide, silica powder) - Two types of particle shapes (spherical, flaky) Due to the effects of core material cost and specific gravity, it achieves significant cost-effectiveness compared to conventional silver fillers. *For details, please refer to the [supplementary materials].

    Non-ferrous metals
pdt-pw_pt-product-index-img-01.jpg

Silver-plated conductive material TOYAL TecFiller TFM series

pdt-pw_pt-product-index-img-01.jpg
pdt-pw_pt-product-index-img-01.jpg
  • Related Link - https://www.toyal.co.jp/products/pw_pt/product/tec…
  • Special site - Product/service details - https://pr.mono.ipros.com/toyal/product/

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basic information

〇Copper Core: Series with copper as the core material ・TFM-C05F ・TFM-C02P 〇Silica Core: Series with silica as the core material ・TFM-S02P ・TFM-S05P

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Applications/Examples of results

〇Applications - Conductive ink - Fillers for conductive adhesives applications

catalog(6)

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TFM Series Introduction Document

TFM Series Introduction Document

TECHNICAL
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[Supplementary Material] Regarding the Cost Effectiveness of the TFM-S Series

[Supplementary Material] Regarding the Cost Effectiveness of the TFM-S Series

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Technical Report: Conductive Fillers Using Powder Coating Technology

Technical Report: Conductive Fillers Using Powder Coating Technology

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What is a filler that you can't ask about now?

What is a filler that you can't ask about now?

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Technical Data: Powder Coating Technology

Technical Data: Powder Coating Technology

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Do you know about conductive silver plating fillers?

Do you know about conductive silver plating fillers?

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Company information

東洋アルミニウム

東洋アルミニウム

Ferrous/Non-ferrous metals

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Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.

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