Advanced substrate support, high-speed and high-precision 3D measurement device! Depth 5μm, Line Space 2/2 compatible.
We would like to introduce the "NSAT Series" that we handle. It supports a depth of 5μm and a line space of 2/2. Thickness measurement of SR and ABF is possible using the transmission measurement method. This is an advanced substrate-compatible, high-speed, high-precision 3D measurement device. Please feel free to contact us if you have any inquiries. 【Features】 ■ Depth of 5μm, supports line space of 2/2 ■ Thickness measurement of SR and ABF using the transmission measurement method ■ Technical capability and reliability compatible with glass core *For more details, please download the PDF or feel free to contact us.
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【Specifications (Partial)】 ■ Panel Size: Max. 510mm × 610mm ■ Scan Speed: Max. 65um/s ■ Resolution: WSI < 0.5nm, PSI < 0.1nm, Fast CSI < 1.5nm ■ Scanning Operation: Closed-Loop Controlled Piezo Actuator ■ Illumination: White LED Illumination *For more details, please download the PDF or feel free to contact us.
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.