ニデックアドバンステクノロジー Product Lineup

We have achieved the production of the world's smallest class springs through our unique patented technology. We have developed a vertical MEMS spring probe combined with ultra-small plungers. These can be incorporated into fixtures for PCB inspection and probe cards, and are suitable for electrical testing of semiconductors and printed circuit boards. In addition to the ability to select the tip shape of the DUT plunger, we can meet your desired load and stroke through custom design. Please feel free to contact us.

• probe
• Inspection fixture
• Circuit Board Inspection Equipment

Thermocouple technology has been applied to the probe! It is possible to accurately measure the temperature of the DUT!

• Semiconductor inspection/test equipment

The AI-equipped appearance inspection device series "AURCA" for electronic circuit boards and semiconductor silicon wafers is equipped with an autofocus mechanism (AF) that enables quick and accurate focusing. ■ Features - Full-color high-speed line scan - Equipped with autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI + conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

• Defect Inspection Equipment
• Visual Inspection Equipment
• Circuit Board Inspection Equipment

The AURCA series is a next-generation 2D appearance inspection system that combines full-color high-speed scanning with AI technology, compatible with wafers and panels. It features full-color line scanning and an autofocus mechanism, integrating conventional image processing (CV) with AI algorithms. In mass production lines, it simultaneously achieves high detection rates, low false detection, and high-speed processing. ■ Features - Full-color high-speed line scanning - Equipped with an autofocus mechanism (prevents blurriness due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and excessive detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots

• Wafer
• Visual Inspection Equipment
• Defect Inspection Equipment

The AURCA-S series is a 2D appearance inspection device that combines full-color high-speed scanning with high-precision AI analysis. It is designed to accommodate the increasingly fine inspection of wafers in recent years. ■ Features - Full-color high-speed line scanning - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection with AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

• Wafer
• Visual Inspection Equipment
• Defect Inspection Equipment

The AURCA series is a next-generation 2D appearance inspection system that integrates full-color high-speed scanning with AI technology, designed for high-density package substrates. With full-color imaging and a multi-effect optical configuration, it accurately captures a variety of defect characteristics. Furthermore, it goes beyond mere defect detection; the AI analysis function allows for the analysis of the shape and causes of detected defects! It supports the review of previous processes and the formulation of measures to prevent recurrence. ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign matter contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign matter, scratches, oxidation, corrosion, film cracks, bright spots

• Defect Inspection Equipment
• Visual Inspection Equipment
• Circuit Board Inspection Equipment

■Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - AI + conventional algorithm integrated detection (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■Examples of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots

• Defect Inspection Equipment
• Visual Inspection Equipment
• Circuit Board Inspection Equipment

The "AURCA series" is the latest inspection solution that addresses challenges in manufacturing, such as detecting defects that were difficult to identify with conventional image inspection methods and improving yield, all at once. Please make use of it in your quality improvement cycle! ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI + conventional algorithms (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

• Defect Inspection Equipment
• Visual Inspection Equipment
• Circuit Board Inspection Equipment

The "AURCA series" is an AI-equipped visual inspection device that not only conducts inspections but also continuously cycles through analysis → feedback → process improvement, contributing to the maximization of yield across the entire factory for our customers. Additionally, by analyzing the root causes of defects, it helps reduce manufacturing costs and improve product reliability by decreasing the number of defective products. ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

• Defect Inspection Equipment
• Circuit Board Inspection Equipment
• Visual Inspection Equipment

The AURCA series accurately captures changes in the material and height of objects through full-color image acquisition enabled by advanced optical design, significantly reducing over-detection. Defects that were difficult to identify with conventional monochrome images can now be detected! ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection using AI + traditional algorithms (hybrid inspection) - Minimizes miss rates and over-detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

• Semiconductor inspection/test equipment
• Visual Inspection Equipment
• Circuit Board Inspection Equipment

The launch of the next-generation AI visual inspection solution "AURCA Series" that visualizes invisible defects with AI has begun.

• Visual Inspection Equipment
• Defect Inspection Equipment
• Circuit Board Inspection Equipment

The "STAR REC M6V SW" is a high-performance appearance inspection device developed for HDI and IC substrates. It achieves the highest class of high-speed and high-precision inspection in the M6 series, strongly supporting quality assurance for electronic substrates as miniaturization and densification progress. With a high-resolution camera and proprietary image processing technology, it accurately detects even minute defects and abnormalities. By adopting a high-speed transport system, it also contributes to increased productivity. Additionally, it is compatible with automatic transport mechanisms, allowing for flexible adaptation to line automation and labor-saving measures. Furthermore, it combines excellent operability with stable inspection performance, accommodating a wide range from small lots of various types to mass production lines. It provides a high-quality and efficient inspection environment required for next-generation electronic device manufacturing.

• Circuit Board Inspection Equipment

The GATS-7885/8360A is a high-precision continuity insulation testing device developed for interposers and large HDI substrates. In addition to full-panel high-precision inspection, it also supports high-density, multi-pin testing and LCR testing, providing strong support for quality assurance of next-generation semiconductor packages and high-functionality substrates. The GATS-7885 is equipped with a dedicated fixture that supports up to 24K points and is compatible with small-diameter pad probes with a 25μm pitch. It can propose optimal fixture designs tailored to the pad layout. Furthermore, it achieves a comprehensive alignment accuracy of ±3.5μm, enabling stable high-precision inspections. The GATS-8360A, as a high-precision inspection device for large HDI, supports a maximum of 96K points inspection with 32K points on the upper side and 64K points on the lower side. It also accommodates various automation system proposals, supporting productivity improvement and labor reduction. It is the ideal solution for manufacturing environments that require high-precision and high-efficiency inspection.

• Semiconductor inspection/test equipment

"Pulse EYE" is a support tool for the analysis of Power semiconductor testing and waveforms. It features various modes such as "Waveform Analyze," which allows for graph display and manipulation of arbitrary signals, cursor display, selection of analysis position display, and locus graph display functionality, as well as "Dual File View," which enables easy comparison display by overlaying graphs from two files. Please feel free to contact us if you have any inquiries. 【Features】 ■Improved work efficiency/time reduction ■Displays all waveforms in 2-3 seconds with one click ■Analysis position information display ■Comparison of multiple file displays ■Waveform display with black and white inversion *For more details, please download the PDF or feel free to contact us.

• Other network tools

The "TDAS-Series" is a device designed for performance and durability testing of onboard drive motors for EVs/HEVs, as well as E-Axles (integrated motor, inverter, and gear). With original measurement, control, and analysis software and GUI, it allows for simple operation to conduct various tests, including constant torque operation, constant speed operation, and tests tailored to driving patterns such as WLTC. Additionally, it enables real-time monitoring of images and data via a live camera, and remote monitoring through the TDAS monitoring system. 【Features】 ■ Capable of constructing 3-axis/4-axis test benches ■ Capable of constructing test benches for inverters ■ Measurement, control, and analysis possible with simple and easy operation ■ Compatible with TDAS remote monitoring system ■ Supports ultra-high speed of 36,000 rpm *For more details, please download the PDF or feel free to contact us.

• Testing Equipment and Devices

We would like to introduce our IGBT/SiC power module testing equipment, the 'NATS Series'. We offer the automatic testing device "NATS-1000," which achieves low LS values and supports high-precision testing for insulation, static characteristics, and dynamic characteristics, as well as the manual testing device "NATS-1630/1730," which can be integrated with external PCs and upper data management systems such as the cloud. Please feel free to contact us when you need assistance. 【Features】 <NATS-1000> ■ Insulation testing (ISO) ■ Static characteristics testing (DC) ■ Dynamic characteristics testing (AC) ■ High-temperature testing up to 175°C (up to 200°C) ■ High throughput of up to 144 UPH (25 seconds/unit) *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our high-speed, high-precision 3D/2D/SD wafer bump automatic inspection system, the 'RWi-300MK3'. The measurement accuracy for 2D/3D has significantly improved, enabling ultra-fast inspections. Additionally, the speed of defect image acquisition has dramatically increased. Please feel free to contact us if you require further information. 【Features】 ■ Simultaneous measurement of 3D/2D/SD achieved with high speed and high precision ■ Suitable for gold bump 3D inspection ■ Diverse transport systems *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our 3D measurement device compatible with glass substrates, the 'NSAT Series.' It supports a depth of 5μm and a line space of 2/2. It offers various measurement functions such as Trace, Anchor, Overlay, and Film. Please feel free to contact us if you have any inquiries. 【Features】 ■ Supports depth of 5μm and line space of 2/2 ■ Thickness measurement of SR and ABF using transmission measurement method ■ Technical capability and reliability compatible with glass cores *For more details, please download the PDF or feel free to contact us.

• Circuit Board Inspection Equipment

We would like to introduce our "high-precision inspection jigs" that we handle. Products for printed circuit board and semiconductor package inspection systems. They are compatible with fine conductors and electrode pads. We are also developing probes with diameters of 7um and 10um. Please feel free to contact us when needed. 【Features】 ■ One-touch jig ■ Probes with diameters of 7um and 10um in development ■ Four-terminal jig for measuring micro-resistance *For more details, please download the PDF or feel free to contact us.

• Inspection fixture

We would like to introduce our continuity/insulation testing tester 'RZ-1207'. This advanced tester, compatible with flat cables, incorporates a wealth of optional features that can be added as needed. It is well-suited for testing circuit patterns on bare boards and flex circuits, as well as for harness inspections. Please feel free to contact us if you have any inquiries. 【Features】 ■ High speed and high precision ■ Scanner card ■ Up to 16k test points ■ 4W testing ■ μOPEN testing * For more details, please download the PDF or feel free to contact us.

• Tester

The "R-700 Series" is a compactly designed AC/DC MULTI TESTER that offers high speed and high precision. It can inspect various products such as thin-film RF filters, automotive DC modules, acceleration sensors, and MEMS devices. We offer a lineup including the "R-730 Standard," "R-780 High Insulation," and "R-770 AC Dynamic." 【Features】 ■ Ultra high insulation ■ High speed and high precision ■ Compact design ■ Maximum inspection points: 512 pins ■ High resolution for small capacitance measurement ■ 4W low resistance measurement: 0.1mΩ～ *For more details, please download the PDF or feel free to contact us.

• Tester

The R-5940 is a super tester specialized for IC embedded substrates. It meets the diverse needs of high-precision IC testing with high-speed continuity and short-circuit measurements, μΩ accuracy, high-speed testing with four-terminal measurements, and all-CH LCR measurements. By connecting up to 16 SMUs as power supplies and electronic loads to the DUT, it enables the implementation of power ON/OFF sequences, allowing for DUT measurements with freely combined SMUs. 【Features】 ■ High-speed testing ■ High precision ■ Specialized for IC embedded *For more details, please download the PDF or feel free to contact us.

• Tester

The "STAR REC V5III" is a testing device for printed circuit boards that achieves compatibility with fixtures from the V3/V5 series and is equipped with advanced testing capabilities. It improves inspection accuracy and speed, accommodating the inspection of increasingly miniaturized printed circuit boards. Additionally, as an option, it can read 2D codes engraved on the boards, linking inspection results with 2D code information and outputting the data to an external PC in a specified format. Please feel free to contact us if you have any inquiries. 【Features】 ■ Provision of inspection solutions ■ 2D traceability support (optional) ■ Smart factory compatibility (optional) *For more details, please download the PDF or feel free to contact us.

• Circuit Board Inspection Equipment

We would like to introduce our conduction insulation inspection device for large HDI boards, the 'GATS-8350'. It supports both Step & Repeat inspection for multi-panel boards and batch inspection for large boards. Additionally, LUL can provide proposals tailored to your specifications. Please feel free to contact us when you need assistance. 【Features】 ■ High-precision inspection device for large HDI ■ Supports up to 64K points for both upper and lower sides ■ Compatible with both Step & Repeat inspection for multi-panel boards and batch inspection for large boards *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7862'. The overall alignment accuracy is ±2.5μm, designed for inspection of half/quater panels. It supports large, multi-pin substrates such as chiplets. Please feel free to contact us if you have any inquiries. 【Features】 ■ High-precision inspection equipment for half/quater panels ■ Compatible with large, multi-pin substrates such as chiplets ■ Supports various automation requirements *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7836'. LUL can provide proposals tailored to your specifications. We accommodate large multi-pin substrates such as chiplets and various automation requirements. Please feel free to contact us when you need our services. 【Features】 ■ High-precision inspection equipment for large individual pieces/quarter panels ■ Compatible with large multi-pin substrates such as chiplets ■ Accommodates various automation requirements *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

We would like to introduce our high-speed and high-precision inspection equipment for semiconductor packages, the 'GATS-7760'. It supports large, multi-pin substrates such as chiplets. We offer two models: one for individual pieces and one for sheets. Additionally, LUL can provide proposals tailored to your specifications. Please feel free to contact us when you need assistance. 【Features】 ■ High-precision inspection equipment for FC-CSP/large individual piece substrates ■ Compatible with large, multi-pin substrates such as chiplets ■ Two models available: individual piece specification and sheet specification *For more details, please download the PDF or feel free to contact us.

• Semiconductor inspection/test equipment

We would like to introduce our IGBT/SiC power module testing equipment, the 'NSAT Series'. The "NATS-1000" is an automatic testing device for insulation/static characteristics/dynamic characteristics. It can be expanded for automatic lines and complies with IEC60747 measurements. The "NATS-1630/1730" is a manual testing device for dynamic characteristics, capable of interfacing with higher-level data management systems such as external PCs or the cloud. 【NATS-1000 Features】 ■ High-temperature testing up to 175℃ (up to 200℃) ■ High throughput of up to 144 UPH (25 seconds/unit) ■ Low LS of 4.5nH ■ Expandable for automatic lines ■ Complies with IEC60747 measurements ■ AOI/warp inspection/laser marking *For more details, please download the PDF or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce the "NSAT Series" that we handle. It supports a depth of 5μm and a line space of 2/2. Thickness measurement of SR and ABF is possible using the transmission measurement method. This is an advanced substrate-compatible, high-speed, high-precision 3D measurement device. Please feel free to contact us if you have any inquiries. 【Features】 ■ Depth of 5μm, supports line space of 2/2 ■ Thickness measurement of SR and ABF using the transmission measurement method ■ Technical capability and reliability compatible with glass core *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments