RDL defect inspection, bump defect inspection, TSV defect inspection compatible appearance inspection equipment.

The sale of the appearance inspection device "AURCA series," which supports RDL defect inspection, bump defect inspection, and TSV defect inspection, has begun!

The AURCA series is a next-generation 2D appearance inspection system that combines full-color high-speed scanning with AI technology, compatible with wafers and panels. It features full-color line scanning and an autofocus mechanism, integrating conventional image processing (CV) with AI algorithms. In mass production lines, it simultaneously achieves high detection rates, low false detection, and high-speed processing. ■ Features - Full-color high-speed line scanning - Equipped with an autofocus mechanism (prevents blurriness due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and excessive detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots

WaferVisual Inspection EquipmentDefect Inspection Equipment