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  6. AI-equipped visual inspection device for semiconductor wafers and panels "AURCA Series"

AI-equipped visual inspection device for semiconductor wafers and panels "AURCA Series"

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AURCA Series

last updated:Jun 16, 2026

ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所
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The AI-equipped appearance inspection device "AURCA Series" for semiconductor wafers and panels has arrived! It can also inspect semiconductor package substrates and printed circuit boards!

The AURCA-S series is a 2D appearance inspection device that combines full-color high-speed scanning with high-precision AI analysis. It is designed to accommodate the increasingly fine inspection of wafers in recent years. ■ Features - Full-color high-speed line scanning - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection with AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

    WaferVisual Inspection EquipmentDefect Inspection Equipment
AURCA-S.jpg

AI-equipped visual inspection device for semiconductor wafers and panels "AURCA Series"

AURCA-S.jpg
AURCA-S.jpg
  • Related Link - https://www.nidec.com/jp/nidec-advancetechnology/p…
  • Special site - Product/service details - https://pr.mono.ipros.com/nidec-read/product/

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ニデックアドバンステクノロジー

ニデックアドバンステクノロジー 本社、東京営業所、名古屋営業所

Industrial Machinery

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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.

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