Equipped with an autofocus mechanism! Image inspection device "AURCA Series"
AURCA series
Equipped with an autofocus mechanism to prevent distortion blur! Image inspection device "AURCA Series"
The AI-equipped appearance inspection device series "AURCA" for electronic circuit boards and semiconductor silicon wafers is equipped with an autofocus mechanism (AF) that enables quick and accurate focusing. ■ Features - Full-color high-speed line scan - Equipped with autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI + conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.
