Printed Circuit Board Image Inspection Equipment "AURCA Series"
AURCA series
AI inspection and measurement solution for printed circuit boards, image inspection device "AURCA Series"
■Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - AI + conventional algorithm integrated detection (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■Examples of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.
