AI analysis function equipped!! Appearance inspection device
The launch of the next-generation AI visual inspection solution "AURCA Series" that visualizes invisible defects with AI has begun.
Inquire About This Product
basic information
- Full-color high-speed line scan - Equipped with autofocus mechanism (prevention of blurring due to warping) - AI + conventional algorithm integrated detection (hybrid inspection) - Minimization of missed detection rate and excessive detection rate - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (compatible with high throughput mass production)
Price information
Delivery Time
Applications/Examples of results
【Inspection Items】 RDL Defect Inspection: Open, Short, Notch, Metal Residue, CD Variation Bump Defect Inspection: Surface Abnormalities, Dimensional Deviations, Missing/Position Shift TSV Defect Inspection: Metal/Foreign Contamination, Deformation, Dimensional Deviations Other Appearance Defects: Edge Chipping, Adhesive Residue, Dents, Foreign Objects, Scratches, Oxidation, Corrosion, Film Cracks, Bright Spots
catalog（2）
Download All Catalogs
Company information
Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.
