ニデックアドバンステクノロジー Product Lineup

The launch of the next-generation AI visual inspection solution "AURCA Series" that visualizes invisible defects with AI has begun.

The AURCA series accurately captures changes in the material and height of objects through full-color image acquisition enabled by advanced optical design, significantly reducing over-detection. Defects that were difficult to identify with conventional monochrome images can now be detected! ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection using AI + traditional algorithms (hybrid inspection) - Minimizes miss rates and over-detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

The "AURCA series" is an AI-equipped visual inspection device that not only conducts inspections but also continuously cycles through analysis → feedback → process improvement, contributing to the maximization of yield across the entire factory for our customers. Additionally, by analyzing the root causes of defects, it helps reduce manufacturing costs and improve product reliability by decreasing the number of defective products. ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

The "AURCA series" is the latest inspection solution that addresses challenges in manufacturing, such as detecting defects that were difficult to identify with conventional image inspection methods and improving yield, all at once. Please make use of it in your quality improvement cycle! ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI + conventional algorithms (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

■Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - AI + conventional algorithm integrated detection (hybrid inspection) - Minimizes missed detection and excessive detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■Examples of inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign object contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign objects, scratches, oxidation, corrosion, film cracks, bright spots

The AURCA series is a next-generation 2D appearance inspection system that integrates full-color high-speed scanning with AI technology, designed for high-density package substrates. With full-color imaging and a multi-effect optical configuration, it accurately captures a variety of defect characteristics. Furthermore, it goes beyond mere defect detection; the AI analysis function allows for the analysis of the shape and causes of detected defects! It supports the review of previous processes and the formulation of measures to prevent recurrence. ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI and conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Reduces inspection time by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign matter contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign matter, scratches, oxidation, corrosion, film cracks, bright spots

The AI-equipped appearance inspection device series "AURCA" for electronic circuit boards and semiconductor silicon wafers is equipped with an autofocus mechanism (AF) that enables quick and accurate focusing. ■ Features - Full-color high-speed line scan - Equipped with autofocus mechanism (prevents blurring due to warping) - Integrated detection of AI + conventional algorithms (hybrid inspection) - Minimizes miss rate and false detection rate to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example Inspection Items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots

By using high-resolution 2D and 3D cameras, and combining them with NIR (near-infrared), we have achieved the detection of all types of defects. In addition to conventional high-precision surface inspection, it is now possible to measure internal defects and depth using NIR. Furthermore, the range of compatible materials has expanded beyond just glass to include SiC/silicon wafers, ABF films, and more. Please feel free to contact us.

■Do you face these challenges in semiconductor and wafer inspection? - You cannot afford to miss tiny defects, but excessive detection is common, leading to lower yield. - It is difficult to balance efficiency and accuracy in the inspection process. The image inspection device 'AURCA' equipped with AI analysis capabilities solves these challenges. 【Reasons to Choose AURCA / Differences from Competitors】 ▼Overwhelming inspection accuracy with AI analysis × full color Tiny scratches and unevenness that were difficult to distinguish with conventional monochrome images can be accurately identified by combining full-color images with advanced AI analysis. The accuracy of distinguishing between good and defective products dramatically improves. ▼Reduce setup time with auto-focus function Automatically adjusts focus according to the object. This shortens the setup time and allows for high-resolution inspections under optimal conditions at all times. 【Benefits of Implementation】 - Significantly reduce excessive detection and improve the yield of semiconductor substrates. - Decrease reliance on visual inspections, achieving stabilization of quality and cost reduction. The catalog includes detailed product specifications, the mechanism of AI analysis, and detection capability data. Please use it as a reference for comparison during your evaluation of implementation.