Full-color appearance inspection device "AURCA Series"
The AURCA series accurately captures changes in the material and height of objects through full-color image acquisition enabled by advanced optical design, significantly reducing over-detection. Defects that were difficult to identify with conventional monochrome images can now be detected! ■ Features - Full-color high-speed line scan - Equipped with an autofocus mechanism (prevents blurring due to warping) - Integrated detection using AI + traditional algorithms (hybrid inspection) - Minimizes miss rates and over-detection rates to the extreme - Automatic classification and quantitative measurement of defects (length, width, area, position) - Inspection time reduced by over 30% (supports high throughput mass production) ■ Example inspection items - RDL defect inspection: open, short, notch, metal residue, CD variation - Bump defect inspection: surface anomalies, dimensional deviations, missing/position misalignment - TSV defect inspection: metal and foreign material contamination, deformation, dimensional deviations - Other appearance defects: edge chipping, adhesive residue, dents, foreign materials, scratches, oxidation, corrosion, film cracks, bright spots
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.
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