ニデックアドバンステクノロジー Product Lineup

We would like to introduce our high-speed, high-precision 3D/2D/SD wafer bump automatic inspection system, the 'RWi-300MK3'. The measurement accuracy for 2D/3D has significantly improved, enabling ultra-fast inspections. Additionally, the speed of defect image acquisition has dramatically increased. Please feel free to contact us if you require further information. 【Features】 ■ Simultaneous measurement of 3D/2D/SD achieved with high speed and high precision ■ Suitable for gold bump 3D inspection ■ Diverse transport systems *For more details, please download the PDF or feel free to contact us.

We would like to introduce our IGBT/SiC power module testing equipment, the 'NATS Series'. We offer the automatic testing device "NATS-1000," which achieves low LS values and supports high-precision testing for insulation, static characteristics, and dynamic characteristics, as well as the manual testing device "NATS-1630/1730," which can be integrated with external PCs and upper data management systems such as the cloud. Please feel free to contact us when you need assistance. 【Features】 <NATS-1000> ■ Insulation testing (ISO) ■ Static characteristics testing (DC) ■ Dynamic characteristics testing (AC) ■ High-temperature testing up to 175°C (up to 200°C) ■ High throughput of up to 144 UPH (25 seconds/unit) *For more details, please download the PDF or feel free to contact us.