Ultrasonic grinding machine optimal for processing hard and brittle materials such as SiC and PCD.

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basic information

■Features ○ By applying ultrasonic vibrations in the radial direction of the diamond grinding wheel, it is possible to efficiently process with the combined effect of 'grinding force + crushing force from ultrasonic hammering.' ○ The processed surface becomes finer than the grit of the grinding wheel, so when using a grinding wheel of the same grit, the surface is cleaner with ultrasonic assistance. ○ It reduces clogging of the grinding wheel, allowing for longer dressing intervals. Additionally, it enables an increase in cutting pitch and feed speed, which can shorten processing time. ○ Customization is possible according to the material and size of the target workpiece. ■Main Specifications ○ Table working surface: 150mm × 102mm ○ Table movement (left and right): 10mm to 100mm ○ Grinding wheel movement (front and back): 100mm ○ Distance from the top of the table to the center of the grinding wheel axis: 95 to 245mm ○ Maximum load capacity of the table: 7kg ○ Maximum number of reversals: 1000 times/min ○ Maximum rotational speed of the grinding wheel: 3000 min⁻¹ ○ Control device: FANUC 0i-M series *For more details, please contact us.

Price information

16 million yen The price varies depending on the special specifications.

Price range

P7

Delivery Time

Applications/Examples of results

■Materials that the ultrasonic grinding machine 'IUG0101' excels at 〇PCD (polycrystalline diamond) 〇SiC (silicon carbide) 〇Glass 〇Cemented carbide 〇Ceramics (alumina, quartz) *Please consult us for other materials. *For more details, please contact us.