Adopts DUAL Jetson AGX Orin (up to 550 TOPS), dustproof and waterproof IP67, supports automotive GMSL cameras.
【RayTol RB-2 Features】 ■ Width 377 × Height 74 × Depth 199 mm ■ Equipped with dual NVIDIA Jetson AGX Orin modules and two fans ■ Includes Infineon TC397 safety MCU for automotive applications ■ Adopts IP67 rated dustproof and waterproof enclosure ■ Supports up to 550 TOPS AI performance ■ Supports 16 automotive GMSL cameras ■ Equipped with TSN Ethernet switch IC for automotive use ■ Compatible with high-precision dual antenna GNSS and IMU module (optional) ■ Supports synchronous and asynchronous triggering for multiple cameras (parameters can be flexibly set) ■ 4x 1000M/100MBase-T (industrial Ethernet), 4x 1000M/100MBase-T1 (automotive Ethernet), 1x 10GBase-T ■ 2 USB 3.1, 3 USB 2.0 type-C, 3 RS-232/422/485, 2 HDMI, 1 DP, 6 CAN, 8x GPIO ■ Wide operating temperature range of -25°C to 75°C ■ Supports power input of 9-36V
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Specifications ■ Equipped Modules: 2x Jetson AGX Orin 32GB - 400 TOPS (1792-core, 56 Tensor Cores + 8-core ARM Cortex-A78AE CPU + 32 GB LPDDR5, 200 TOPS/Orin) 64GB - 550 TOPS (2048-core, 64 Tensor Cores + 12-core ARM Cortex-A78AE CPU + 64 GB LPDDR5, 275 TOPS/Orin) Infineon TC397 - 768KB (+ECC) ■ Storage: 1×64GB eMMC 5.1 (32/64GB), 16MB (+ECC) (TC397) ■ Expansion Slots: 1x m.2 key-M, 1x m.2 key-B, 1x m.2 key-E, 1x Nano SIM card, 1x TF card, 8 x PPS/SYNC OUT, 1x PPS/SYNC IN, 8x GPIO ■ Camera: 16 x GMSL1/2 ■ Input Power: DC 9–36V input ■ Weight (kg): 4.5kg
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※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.