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  6. High-density semiconductor dispenser nozzle "Pinpoint Nozzle"

High-density semiconductor dispenser nozzle "Pinpoint Nozzle"

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last updated:Oct 11, 2024

テクダイヤ
テクダイヤ
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This is a cutting-edge dispenser nozzle utilizing micro-drilling technology, thin-walled processing technology, and precision machining technology.

A high-precision dispensing nozzle specifically designed for "narrower" and "deeper" pinpoint applications in high-density semiconductors with densely arranged parts. This is the most advanced dispenser nozzle created by Tekudai, set to launch in the fall of 2024. ◆ An ultra-fine tip with a thickness of 0.02mm, optimal for "narrower" points Utilizing advanced thin-wall processing technology, the difference between inner and outer diameters is controlled to the extreme (thickness of 0.02mm). It can reach into the narrow gaps of high-density semiconductors. ◆ A 2mm long tip that reaches "deeper" points The length of the nozzle tip has been doubled from the conventional 1mm to 2mm. This allows for precise dispensing at deep points, such as between components. Additionally, our unique integrated processing achieves high-precision dispensing, unlike the press-fit method.

    nozzle
高集積化半導体用ディスペンサーノズル「ピンポイントノズル」【テクダイヤ株式会社】-scaled

High-density semiconductor dispenser nozzle "Pinpoint Nozzle"

高集積化半導体用ディスペンサーノズル「ピンポイントノズル」【テクダイヤ株式会社】-scaled (1).jpg
高集積化半導体用ディスペンサーノズル「ピンポイントノズル」【テクダイヤ株式会社】-scaled (1).jpg
  • Related Link - https://www.tecdia.com/jp/pinpointnozzle/

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◆Specifications (Unit: mm) Inner diameter: 0.10 Outer diameter: 0.14 Tip length: 2.0 Inner diameter: 0.15 Outer diameter: 0.19 Tip length: 2.0 Inner diameter: 0.20 Outer diameter: 0.24 Tip length: 2.0 Inner diameter: 0.25 Outer diameter: 0.29 Tip length: 2.0 Inner diameter: 0.30 Outer diameter: 0.34 Tip length: 2.0 For inquiries regarding specifications other than those listed above, please contact us.

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Applications/Examples of results

Main markets: semiconductor manufacturing, camera module manufacturing, biomedical industry, medical (such as endoscope manufacturing)

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High-density semiconductor dispenser nozzle "Pinpoint Nozzle"

High-density semiconductor dispenser nozzle "Pinpoint Nozzle"

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テクダイヤ

テクダイヤ

Machine elements and parts

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In the rapidly accelerating semiconductor market, we at TechDaiya have consistently provided advanced electronic components, devices, precision tools, and solution services that meet customer needs. The core competence of TechDaiya, born from the collaboration of our divisions in electronic component parts, precision machining products, and device development, lies in our unique flexible thinking and technological capabilities, which enable excellent development through our abundant human resources. This leads to the creation of innovative product groups. Above all, we can quickly provide "optimal solutions for our customers" that maximize the potential of these products. As a one-of-a-kind company that is recognized globally, TechDaiya will continue to boldly expand products and services that fuse human resources and technological capabilities into the global market.

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