Electronic Patent Technology Trend Survey Report on Simulation and Thermal Analysis
You can view patent information categorized by the following technical classifications: - Estimation of reaction states involving heat - Optimization of heat transfer systems - Setting of boundary conditions - Improvement of convergence - Learning models
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PDF version To understand the behavior of phenomena related to fluid flow and heat transfer, we can utilize thermal fluid analysis technology and simulate phenomena using simulation techniques. 1. Visualize and analyze phenomena, and implement countermeasures, 2. Quantify phenomena and select optimal conditions, and more. This patent guidebook covers patent information related to simulation technology utilizing thermal fluid analysis technology. It focuses on the following application examples: - A technology that can estimate physical quantities at the end of mixing, which was difficult to achieve with current simulation techniques without incurring computational costs. - A technology that predicts the amount of liquefied gas consumption, required time, and labor needed to cool the temperature inside a tank to a specified target temperature through pre-cooling simulation of the receiving tank. - A technology that appropriately estimates the boundary conditions used when predicting temperature within the target space through simulation. - A technology that prevents the divergence of the fluid model temperature at the outlet by differing the temperature of the fluid model returning to the inlet from that at the outlet during the heat transfer calculation process.
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Dynamic Map: [Price] 180,000 yen + tax Patent Guidebook: [Price] 80,000 yen + tax University Patent: [Price] 30,000 yen + tax All companies addressing key markets: [Price] 30,000 yen + tax NEO Report: [Price] 180,000 yen + tax Web preview is available. We will introduce the actual products. Please feel free to consult with us.
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