CPU module "SMARC" [LEC-IMX95]

This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution

● Based on the NXP i.MX 95, it achieves AI performance of up to 2 TOPS. Compliant with SGeT SMARC 2.2 and OSM 1.2, it provides scalable and efficient edge intelligence. ● OSM-IMX95: A robust 45mm x 45mm solderable module adopting ADLINK's single-sided PCB design. It offers AI-driven performance for compact, power-constrained edge devices. ● SMARC LEC-IMX95: An 82 mm x 50 mm SGeT SMARC 2.2 module. Equipped with 10 GbE, secure boot, and industrial reliability, it enables intelligent IoT and automation. ● Providing customized high-performance edge solutions for various industries through diverse options and flexible ODM customization.