ADLINKジャパン List of News Articles

ADLINK Japan, in collaboration with its alliance partner Marubun Corporation, will hold the "Marubun x ADLINK Edge Open Forum 2026" seminar on September 15 (Tuesday)! This seminar, titled "Edge AI Computing Supporting the Era of Physical AI," will feature speakers from AMD, Intel, and NXP who will introduce the latest trends. As the utilization of generative AI rapidly advances, there is increasing attention on "Physical AI," where AI recognizes and judges the real world and acts autonomously. In the manufacturing and logistics industries, the use of robots, autonomous transport systems, and image recognition systems is accelerating as a response to labor shortages and the need for productivity improvement. This seminar will introduce the latest trends in edge computing technologies and AI platforms that support Physical AI, along with actual case studies, and will explain solutions that can be utilized on-site. Additionally, through the collaboration between Marubun and ADLINK, we aim to propose a total solution that includes hardware selection, system construction, and implementation support, contributing to the DX promotion of participating companies and the creation of new business opportunities. Please refer to the related materials for the agenda.

ADLINK Technology, a global leader in edge AI computing, will exhibit at COMPUTEX 2026. Under the theme "Leading Edge AI Computing," ADLINK will collaborate with a global ecosystem to showcase seven key edge AI application zones. This exhibition will demonstrate how AI is evolving from theoretical model inference to real-world perception, decision-making, control, and autonomous behavior, accelerating the adoption of physical AI and edge AI agents in fields such as manufacturing, healthcare, retail, humanoid robots, and unmanned vehicles.

May 27, 2026 – ADLINK Technology, a global leader in edge AI computing, will exhibit at COMPUTEX 2026. Under the theme "Leading Edge AI Computing," ADLINK will collaborate with a global ecosystem to showcase seven key edge AI application zones. This exhibition will demonstrate how AI is evolving from theoretical model inference to real-world perception, decision-making, control, and autonomous behavior, accelerating the adoption of physical AI and edge AI agents in fields such as manufacturing, healthcare, retail, humanoid robots, and unmanned vehicles. This year's exhibition will integrate cutting-edge technologies from ADLINK's global AI platform partners, including Intel, NVIDIA, MediaTek, NXP, AMD, and Qualcomm Technologies, showcasing ADLINK's expertise in system integration across architectures and domains. For more details, please refer to the link below.

● Achieves testing of precision ICs and low-power devices with high-speed and wide-ranging SMU. ● Scalable 9/12-slot PXI Express platform provides up to 16 GB/s system bandwidth. ● Supports both complete chassis and backplane-only system designs with flexible deployment options.

This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution

● Comprehensive portfolio expansion: ADLINK has introduced the Intel Xeon 6 series for workstations. This lineup, which includes the ISB-W890 board and AXE GPU server, enables the expansion of edge AI from traditional workloads to real-time generative AI and advanced analytics. ● Versatile high-performance architecture: A lineup designed for compute-intensive tasks such as intelligent automation and large-scale visual processing, ranging from flexible CEB server boards to 2U/4U GPU servers. ● Rapid deployment: Streamlines the transition from AI development to full-scale edge deployment with mission-critical reliability, reducing time to market.

●ADLINK announces the IPC platforms IAP & EVP, which have obtained global certification, to accelerate deployment across regions. ●ADLINK releases an integrated, globally compliant industrial PC with a pre-validated I/O ecosystem. ●ADLINK's new IAP & EVP platform accelerates OEM time-to-market with global certification support.

●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.

● Achieves up to 180 TOPS for complex edge AI workloads ● Simplifies system integration, especially for graphics-intensive applications, with Intel Arc GPU featuring up to 12 Xe cores ● Maximizes power efficiency and responsiveness with an advanced hybrid CPU architecture (P/E cores and LPE cores) combined with 128GB DDR5 memory ● Adds industrial temperature-rated SKUs. Equipped with IBECC memory and TSN Ethernet, ideal for mission-critical robust applications ● Implements Intel Core Ultra Series 3 in a compact COM-HPC Mini form factor, designed for space-constrained applications. Expected to be available in Q2 2026

●ADLINK won two awards at the 2025 Gartner Eye on Innovation Awards (Asia-Pacific), solidifying its leadership in advanced manufacturing utilizing AI. ●Built on the ADLINK Edge AI Agent Platform (EAAP), this edge agent AI, integrated with NVIDIA-certified AXE edge AI servers, NVIDIA RTX 6000 Ada generation GPUs, and NVIDIA Omniverse, enables proactive real-time manufacturing decision-making while ensuring the privacy of sensitive data. ●As a result, it has successfully improved Overall Equipment Effectiveness (OEE) by 80% and increased monthly production by 20%, supporting customers worldwide in achieving high-quality and stable advanced manufacturing.

ADLINK Technology announced today that it has successfully obtained IEC 62443-4-1 certification, an internationally recognized cybersecurity standard for industrial control systems. This significant achievement demonstrates that ADLINK has established an auditable, sustainable, and reproducible secure engineering framework throughout the secure product development lifecycle (SDL), reinforcing the company's commitment to providing safe, reliable, and highly resilient edge computing solutions to customers worldwide.