ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!

"Pocket AI," a portable GPU accelerator equipped with NVIDIA RTX A500.

Pocket AI offers ultimate flexibility and reliability on the go. This portable plug-and-play AI accelerator provides the perfect power/performance balance from NVIDIA RTX GPUs. Pocket AI is the ideal device for AI developers, professional graphics users, and embedded industrial applications, enhancing productivity by improving work efficiency.

• Image Processing Equipment
• Industrial PCs

Intel Core Ultra Processor Series 3 COM Express R3.1 Type 6 Basic Size Module

ADLINK's Express-PTL is a next-generation COM Express Type 6 computer-on-module equipped with the Intel Core Ultra Series 3 (Panther Lake-H) processor, achieving a significant leap in performance for edge AI and advanced embedded systems. It features a powerful hybrid CPU architecture with P, E, and low-power LPE cores, supporting up to 128GB of DDR5 memory and IBECC, ensuring high reliability and efficiency. The Express-PTL integrates the next-generation Intel Arc Xe3 GPU, which delivers up to 1.5 times the graphics performance, and an NPU with up to 180 TOPS, enabling fast and efficient AI inference, computer vision, and graphics-intensive workloads within a compact, standard-based COM Express form factor. The Express-PTL supports a rich array of high-speed I/O, including industrial features such as PCIe Gen4, multiple display options, USB4/Thunderbolt capabilities (build options), TSN Ethernet, TPM 2.0, and advanced power management.

• Embedded Board Computers

COM Express Type 6 Compact with AMD Ryzen Embedded 8000 series processor

The cExpress-R8 is a COM Express COM.0 R3.1 Type 6 Compact module equipped with AMD Ryzen Embedded 8000 series processors (8845HS, 8840U, 8645HS, 8640U), achieving industrial performance across different dimensions. This module, featuring up to 8 "Zen 4" cores (16 threads), integrated AMD RDNA 3 graphics, and an XDNA NPU, delivers up to 39 TOPS of performance, enabling power-efficient AI inference and rapid decision-making in industrial edge environments. The cExpress-R8 supports dual-channel DDR5 memory (non-ECC/ECC options available) of up to 96GB with a speed of 5600 MT/s, providing exceptional responsiveness and performance. It can also drive up to 4 independent displays (DP, eDP, HDMI, LVDS, or VGA), making it ideal for advanced visual applications.

• Embedded Board Computers

NXP i.MX95 equipped SMARC 2.1 short-size module

ADLINK's LEC-IMX95 is a state-of-the-art SMARC revision 2.1 compliant module based on the powerful NXP i.MX95 (Arm Cortex-A55 x6 + Arm Cortex-M7 x1 + Arm Cortex-M33 x1) processor, integrating an ISP and an eIQ Neutron Neural Processing Unit (NPU) that operates at up to 2 TOPS. It features high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and capabilities for fast data processing along with safety and security functions.

• Embedded Board Computers

NXP i.MX95 series processor equipped OSM R1.2 Size L module

The ADLINK OSM-IMX95 is a compact module compliant with the latest OSM revision 1.2, based on the powerful NXP i.MX95 processor (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) and integrates an eIQ Neutron neural processing unit (NPU) that operates with an ISP and up to 2 TOPS. Its dimensions are 45mm x 45mm. It offers high-performance computing with excellent power efficiency, immersive 3D graphics powered by Arm Mali, an innovative NXP NPU accelerator for machine learning, and features for fast data processing and security.

• Embedded Board Computers

OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.

The OSM-MTK510 is an OSM R1.1 Size L module equipped with the advanced MediaTek Genio 510 series processor. It features a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, boasting an excellent MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. It excels in providing edge AI processing with ultra-low power consumption. The OSM-MTK510 supports a variety of graphic outputs including HDMI/DP, eDP, and DSI, and comes with comprehensive connectivity options such as GbE x1, I2S audio codec interface, USB 3.0 x1, and USB 2.0 x2 interfaces, making it versatile and robust. It is equipped with 17x GPIO and guarantees long-term availability with a 10-year product lifecycle.

• Embedded Board Computers

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

• Embedded Board Computers

NVIDIA Jetson Orin Nano-based industrial AI smart camera for edge applications.

ADLINK's NVIDIA Jetson-based industrial AI camera NEON-2000-ONO series integrates Orin Nano, image sensors, an optimized OS, and extensive I/O for vision applications into a compact housing with confirmed thermal stability, reducing the total cost of ownership in integration and troubleshooting while minimizing the cable wiring and space required for installation.

• Color camera
• Surveillance Cameras

High-performance fanless edge AI computer equipped with 12th/13th/14th/15th generation Intel processors.

The DLAP-5200 is a robust and high-performance AI computer designed to meet the demands of challenging applications. It is equipped with 12th/13th/14th/15th generation Intel Core i processors and supports up to 128GB of DDR5 memory at 4800MHz for fast and efficient processing. This system is compatible with MXM 3.1 Type A/B GPU modules, catering to graphics-intensive tasks. This computer boasts a rugged fanless design, enabling continuous operation in harsh environments. It is equipped with front-accessible I/O ports, enhancing the user experience by simplifying connections with various display ports, USB interfaces, Ethernet ports, and supporting a wide range of peripherals and networks.

• Image Processing Equipment
• Other security and surveillance systems
• Industrial PCs

Compact edge computing platform equipped with 13th generation Intel Core processors.

The MXE-310 is a cost-effective, fanless, and expandable edge computing platform equipped with 13th generation Intel Core i7/i5/i3 processors. Designed to deliver high performance in a compact form factor, the MXE-310 supports up to 64GB of DDR5 4800MHz memory and operates efficiently within a temperature range of -20°C to 60°C. It offers a rich array of connectivity options, including three monitor outputs (Type-C, DisplayPort, HDMI) and up to six LAN ports, catering to various industrial applications. Additionally, it features multiple I/O expansion options, including M.2 slots (B-Key, E-Key, M-Key) and adaptive function modules, along with a wealth of I/O interfaces such as 16-bit DIO, four COM ports, and optional CAN bus. Furthermore, the MXE-310 integrates TPM 2.0 for enhanced security and supports EdgeGO remote management and control software for easy operation and maintenance.

• Industrial PCs
• Embedded Board Computers

2U Short Depth AI GPU Server with Intel Xeon 600 Processor for Workstations

The ADLINK AXE-7220GW is a compact 2U short-depth AI GPU server equipped with Intel Xeon 600 processors for workstations, supporting a maximum TDP of 350W. The ultra-short-depth chassis, specially designed for space-constrained edge environments, maximizes rack efficiency without sacrificing performance, enabling high-bandwidth vision workloads and real-time AI inference in tight spaces and remote deployment sites. - Compact Edge Optimization: Featuring a 2U chassis with a depth of 438mm, it maximizes space efficiency in small racks and limited edge spaces. - Dual GPU Performance: Supports up to 2 FHFLDW PCIe Gen5 x16 GPU cards, providing overwhelming processing power necessary for high-load AI processing and fast visual analysis. - High-Density Thermal Management: Equipped with 4 built-in fan modules and high-speed DDR5-6400 memory, it achieves stable high-performance operation despite its small form factor.

• server

Embedded robot controller equipped with NVIDIA Jetson AGX Orin module

The RQX-59 series, a ROS 2 compatible robot controller equipped with the NVIDIA Jetson AGX Orin module, features an integrated NVIDIA Volta GPU and dual deep learning accelerators, along with various interfaces such as GMSL1/2 or FPD-Link III camera connectors, enabling advanced robot system integration. The RQX-59 series fully supports resources developed with the NVIDIA JetPack 5.0 SDK and ADLINK's Neuron SDK, making it particularly suitable for robot applications that require low power consumption and high AI computing capabilities.

• Industrial PCs

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

Yazaki Energy System will be exhibiting at the "14th Agricultural WEEK (commonly known as J-AGRI)" held at Makuhari Messe. In response to challenges surrounding agriculture, such as record heat and soaring energy prices, our company proposes an agricultural system that utilizes surplus solar heat and waste heat from factories during the summer to support stable cultivation throughout the year, from winter heating to summer cooling. ■ Exhibition Details (Booth Number: 25-47) <Closed-type Agricultural House> Results from the second season and initiatives for the third season <Localized Cooling in Solar-Powered Agricultural Houses> Mechanism of substrate cooling, comparison of energy consumption with spatial cooling, growth conditions this summer <Cooling and Heating with Solar Heat> Examples of crown heating and house cooling, utilization of surplus heat in summer <Cooling of Crops and Workers with Well Water> Exhibition of a prototype well water cooler and proposals for the use of cooling jackets When you visit, please be sure to stop by our booth.

We would like to inform you about the autumn and winter internship opportunities for the 2028 graduates. 1. Open Company Dates: October 23, 2026 (Friday), November 11, 2026 (Wednesday), December 10, 2026 (Thursday), January 21, 2027 (Thursday) Time: 13:30 - 15:30 Location: Online (Microsoft Teams) 2. 1-Day Job Experience Dates: November 17, 2026 (Tuesday), December 16, 2026 (Wednesday) January 15, 2027 (Friday), January 27, 2027 (Wednesday), February 4, 2027 (Thursday), February 10, 2027 (Wednesday), February 18, 2027 (Thursday) Time: 10:00 - 17:30 (tentative) Location: Takaya Corporation Headquarters (661-1 Ibara-cho, Ibara City, Okayama Prefecture)

Notice of participation in the "FOOD Expo 2026." 【Date and Time】 　November 11 (Wednesday) - 13 (Friday), 2026 　Opening hours: 10:00 AM - 5:00 PM 【Venue】 　Tokyo Big Sight 　East Hall 2, Booth Number B-36 【Exhibits】 　Cardboard insulated boxes 　Craft cooler cubes 　Vacuum insulated panel 　Pallet cubes

[Lecture Topics] 1. Co-creation Strategy to Deliver AI to the Field - Business Development and Joint Ventures in the Era of Generative AI and Physical AI Mr. Haruto Suzuki, Industrial and Regional Research Department, Development Bank of Japan 1. The Mechanism of Generative AI and Its Current Utilization by Companies 2. Expansion of the Generative AI Market and AI Infrastructure 3. Transition from Generative AI to Physical AI 4. Bottlenecks in Social Implementation and Solutions through Joint Ventures 5. Formation of an Implementation Ecosystem through Policy and Finance 6. Q&A / Business Card Exchange 2. Needs, Development Trends, Future Possibilities, and Challenges of Physical AI Mr. Kazushi Asama, Senior Researcher, Next-Generation Robot Research Organization, Waseda University / Emeritus Professor, University of Tokyo 1. What Physical AI Means 2. Needs for Physical AI and the Technological Trends of Generative AI Behind It 3. Development Trends of Physical AI 4. Future Possibilities and Challenges of Physical AI 5. Q&A / Business Card Exchange