Technology and reliability compatible with glass core! High-speed, high-precision 3D measurement device.
We would like to introduce our 3D measurement device compatible with glass substrates, the 'NSAT Series.' It supports a depth of 5μm and a line space of 2/2. It offers various measurement functions such as Trace, Anchor, Overlay, and Film. Please feel free to contact us if you have any inquiries. 【Features】 ■ Supports depth of 5μm and line space of 2/2 ■ Thickness measurement of SR and ABF using transmission measurement method ■ Technical capability and reliability compatible with glass cores *For more details, please download the PDF or feel free to contact us.
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【Measurement Functions】 ■Trace ■Pad ■Via ■Anchor ■Overlay ■Film *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our inspection target areas include printed circuit boards, semiconductor packages, and display panels. These are core components of information and communication devices that are growing increasingly due to advancements in IT, as well as widely adopted digital home appliances. Printed circuit boards, semiconductor packages, and display panels are evolving at an astonishing speed, and higher precision technologies are required in inspections. Our company holds a significant share in these inspection fields that demand cutting-edge technology, and we have delivered numerous products recognized as "de facto standards" in the industry worldwide.