[Case Study] Defect Analysis of Automotive PCBs and In-Vehicle PCBs

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TAKAYA APT Series

last updated：Dec 19, 2025

TAKAYA Corporation

Please utilize Takaya's flying probe tester for defect analysis of automotive substrates and in-vehicle substrates.

In the analysis of defective automotive circuit boards, utilizing a flying probe tester enables the rapid identification of defective areas and improves repairability. By shortening analysis time and reducing waste circuit boards, we aim to achieve both quality enhancement and cost efficiency, contributing to increased reliability in the automotive industry. 【Implementation Results】 - Analyzed defective areas of circuit boards determined to be faulty through functional testing or returned from the market due to failures. - Contributed to product improvement and defect reduction through quick identification of causes. 【Challenges Faced by Customers】 Need for Advanced Knowledge: Defect analysis requires knowledge of circuit design, implementation technology, and operational characteristics. In complex automotive circuit boards, the causes can be diverse, making analysis challenging. Prolonged Analysis Time: Manual analysis and visual confirmation can be time-consuming and may fail to identify defective areas. This is particularly difficult in multilayer boards where detecting internal connection failures or fine short circuits is challenging. Generation of Waste Circuit Boards: If defective areas cannot be identified, the entire circuit board may have to be discarded, leading to increased costs.

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**Benefits of Introducing a Flying Probe Tester** Utilization of the Flying Probe Tester: By using the APT (Flying Probe Tester), it is possible to analyze the electrical characteristics of the circuit board in detail without contact. It can detect subtle defects (short circuits, open circuits, abnormal resistance values, etc.) that could not be identified through functional testing. Rapid Identification of Defective Areas: Direct access to specific points in the circuit allows for quick identification of problem areas. Scanning the entire circuit enables early detection of physical damage or design flaws. Reduction of Discarded Circuit Boards: By identifying defective areas, circuit boards can be repaired if possible. This minimizes the number of irreparable boards and reduces disposal costs. Support for Advanced Analysis: Data suitable for defect analysis due to the harsh operating environment specific to automobiles (high temperatures, humidity, vibration) can be obtained. Inspections that simulate actual operating conditions confirm the reproducibility of issues.

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Applications/Examples of results

**Effects of Implementation** Reduction in Analysis Time: Achieves cause identification in significantly shorter time compared to manual analysis. Enables rapid feedback to the manufacturing line. Quality Improvement: Promotes improvements in design and manufacturing processes based on detailed data of defective areas. Reduces defect rates by implementing measures to prevent recurrence. Cost Reduction: Minimizes the occurrence of discarded circuit boards and increases the number of recyclable boards. Reduces costs associated with market complaint responses and enhances customer satisfaction. **Application Examples** ECU (Engine Control Unit) Circuit Boards: Analysis of connection failures and component degradation due to high-temperature environments and vibrations. ADAS (Advanced Driver Assistance Systems) Circuit Boards: Detection of micro short circuits and opens in high-density mounted circuit boards. In-vehicle Infotainment Circuit Boards: Identification and repair of causes for audio and video output failures.