[SEMICON Exhibition] Ceramics, Composite Materials MMC

basic information

<Engineering Ceramics> ● Silicon Carbide: Our specialty, with minimal strength reduction at high temperatures and excellent corrosion and wear resistance. ● Silicon Nitride: Excellent thermal shock resistance and well-balanced material properties. ● Alumina: A popular ceramic. ● Zirconia: High mechanical strength at room temperature and significant fracture toughness. <Metal Matrix Composites (MMC)> ■ SA301, SA401: Cast products containing 30-40 vol% SiC particles in aluminum alloy. ■ SA701: Aluminum infiltrated into SiC porous body (70 vol%). ■ SS501, SS701: Metal silicon infiltrated into SiC porous body (50-70 vol%). <Electronics Ceramics> 【Thin Film Integrated Circuits】Patterning of integrated circuits on various ceramic substrates. ● Side patterns (0.3t or more), formation of AuSn solder patterns. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors. ● Combination of our unique 99.9% alumina substrate and fine patterns enables the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● High dielectric substrates, ALN substrates, and quartz substrates are also supported. 【High-Quality Alumina Substrates】 ● Dense ● Three-point bending strength of 660 MPa (approximately twice that of conventional materials). ● Good electrical properties with low dielectric loss in high-frequency bands.

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Applications/Examples of results

■ Application to Electrostatic Chucks (ESC) - For 3D-NAND etching equipment: SiC/Al 'Cooling Jacket' <Benefits> - Prevention of peeling of alumina ESC and alumina thermal spray - Prevention of surface micro-cracks → Prevention of arcing - Increased etching rate due to improved thermal conductivity and reduced thermal expansion → Increased production capacity ■ Application to Conductive Prober Chucks - For prober equipment: SiC/Si 'Wafer Chuck' <Benefits> - Expanded testable temperature range ex) Room temperature to 200°C → -50°C to 300°C - Improved stability of the measured wafers ■ Application to Pin Chucks - For exposure and inspection equipment: SiC and SiC/Si 'Pin Chuck' <Benefits> - High precision processing with overall flatness of 0.3μm and local flatness of less than 0.05μm. - Reduction of wafer contact area by forming multi-stage pins, preventing particle adhesion. Formation of 2-stage and 3-stage pins is possible.