JAPAN FINE CERAMICS CO., LTD. （JFC） Company Profile

We will jointly exhibit at "SEMICON JAPAN 2024" held at Tokyo Big Sight in December. <Overview of JGC Group's Exhibition> Since its founding, JGC Group has contributed to various fields, including EPC (Engineering, Procurement, and Construction) for plants and factories, primarily in oil refining and natural gas, as well as in diverse businesses such as the manufacturing of catalysts and fine ceramics. In the semiconductor field, we support the semiconductor industry from multiple angles, focusing on "design and construction of semiconductor-related factories," "components for semiconductor manufacturing equipment," and "materials for semiconductor materials." <JFC Exhibits> In the Japan Fine Ceramics corner, we will introduce products and application examples related to semiconductors. ● Guide beams made of metal-ceramic composite materials ● Large trays, stages, and pin chucks made of SiC ● Ceramic substrates and thin-film metallized substrates ● Solid electrolytes, Li-ion sensing films, SOFC/SOEC cells, pressure sensors for hydrogen environments <Exhibition Dates / Venue> Dates: December 13 (Wednesday) to 15 (Friday), 2024, 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 5, Booth No. 6032 Inside the JGC Holdings booth, Japan Fine Ceramics

Our company held a completion ceremony on October 2 for the new factory being constructed at our facility in Tohoku City, Miyagi Prefecture, aimed at mass production of silicon nitride insulating heat dissipation substrates. In pursuit of a low-carbon and decarbonized society, the power electronics sector is actively advancing the development and commercialization of power semiconductors, power semiconductor-equipped circuits, insulating heat dissipation substrates, and power modules, which are essential for energy-saving devices in HV/electric vehicles, high-speed rail, and industrial equipment. For improving power module performance, insulating heat dissipation substrates that can efficiently dissipate heat generated by power semiconductors and electronic devices are crucial. Our silicon nitride insulating heat dissipation substrates possess high thermal conductivity (80-90W), excellent mechanical properties, and insulation, earning high praise from automotive manufacturers and circuit board manufacturers as insulating heat dissipation substrates for power semiconductors used in hybrid and electric vehicles. This led us to decide on the investment for a mass production factory in November 2018, and it has now been completed. In addition to our plan to gradually increase production in line with market expansion, we also intend to realize the commercialization of insulating heat dissipation substrates with thermal conductivity increased to approximately 1.5 times the current level.

Our company has resolved at the board of directors meeting held on May 18, 2020, to conduct an absorption merger with our company as the surviving entity and our 100% subsidiary, Meito Giken Co., Ltd., as the dissolving entity, effective July 1, 2020. We hereby inform you as follows. 1. Purpose of the Merger Through this merger, we aim to further strengthen our integrated production system from raw material formulation to precision processing, and to provide attractive ceramic products and expand our business in the fields of engineering ceramics, electronic ceramics, metal ceramic composite materials, and precision processing of various ceramic components. 2. Summary of the Merger (1) Schedule: Date of board resolution and merger agreement signing: May 18, 2020; Merger date (effective date): July 1, 2020 (planned) (2) Method of Merger: This merger will be conducted as an absorption merger with our company as the surviving entity and Meito Giken Co., Ltd. as the dissolving entity.