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  6. Electronic Ceramics (Thin film integrated circuit components & Substrates)

Electronic Ceramics (Thin film integrated circuit components & Substrates)

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last updated:Jan 27, 2026

JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office
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A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

    High frequency/microwave partsCircuit board design and manufacturingFine Ceramics
回路基板.jpg

Electronic Ceramics (Thin film integrated circuit components & Substrates)

回路基板.jpg
回路基板.jpg 回路基板.JPG アルミナ基板3.JPG SZT2.JPG セラフレックス3.JPG アルミナ基板4.JPG
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basic information

As a substrate manufacturer, we are capable of comprehensive technology development, quality assurance, and problem-solving. We also respond quickly to short delivery times and design changes.

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Applications/Examples of results

○ Submounts and subcarriers for photodiodes and laser diodes ○ Circuit boards for transmitters and receivers used in microwave and millimeter wave bands (amplifier circuits, frequency conversion circuits, oscillator circuits, filter circuits, etc.) ○ Small resistor arrays Circuit boards for measuring instruments Circuit boards for communication devices and radar ○ Circuit boards for sensor heads Components for synthesizers and splitters for optical submarine cables ○ Various types of circuit boards

catalog(9)

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Electronic Ceramics Comprehensive Catalog JFC

Electronic Ceramics Comprehensive Catalog JFC

CATALOG
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[Development Product] Step-type ceramic substrate and thin-film integrated circuit formation

[Development Product] Step-type ceramic substrate and thin-film integrated circuit formation

TECHNICAL
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Thin Film Integrated Circuit Components (MIC)

Thin Film Integrated Circuit Components (MIC)

PRODUCT
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Fine patterning technology that achieves miniaturization and high precision.

Fine patterning technology that achieves miniaturization and high precision.

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[Example of Use] Sensor 99.9% Alumina Substrate

[Example of Use] Sensor 99.9% Alumina Substrate

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Ceramics Substrate Catalog

Ceramics Substrate Catalog

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High-strength alumina substrate for thin films

High-strength alumina substrate for thin films

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[Design Examples and Technology Introduction] High-Frequency Solutions

[Design Examples and Technology Introduction] High-Frequency Solutions

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JGC Group SEMICON JAPAN 2024 Exhibition Information

JGC Group SEMICON JAPAN 2024 Exhibition Information

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News about this product(2)

We exhibited electronic ceramics at the next-generation mobile communications exhibition.

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Thank you to everyone who visited us. We will be exhibiting electronic ceramics at the 1st "Next Generation Mobile Communications Exhibition" held at Tokyo Big Sight. At our booth, we plan to showcase examples of ceramics applications in the communication field, focusing on the theme "Beyond 5G - The Power of Materials Connecting the World," featuring thin plates and films that achieve "space-saving" and "fine pattern formation." Please stop by our booth and find useful information for RF circuit design, heat dissipation design, and space-saving design. 【Event Overview】 Location: Tokyo Big Sight, West Hall 2, Booth No. W5-40 Date: April 8 (Wednesday) to April 10 (Friday), 2015, 10:00 AM to 6:00 PM Last day ends at 5:00 PM Invitation tickets can be obtained from the Next Generation Mobile Exhibition website.

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Exhibited at the 2017 High-Performance Ceramics Exhibition at Tokyo Big Sight from April 5 to 7.

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Thank you to everyone who visited us. We will be exhibiting at the "High-Performance Ceramics Exhibition" held at Tokyo Big Sight in April. At our booth, we will showcase: - A new product that further enhances the fracture resistance of silicon nitride ceramics and improves thermal conductivity. - A new material that does not bend like iron, utilizing the lightweight properties of aluminum, known as "composite materials of metals and ceramics." - "Ceramic substrates" characterized by thin film and film formation technology. If you have any concerns regarding equipment design, component design, thermal design, or anything else, please feel free to stop by our booth for a consultation. We look forward to seeing you.

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JAPAN

JAPAN FINE CERAMICS CO., LTD. (JFC) Tokyo Sales Office

Ceramics

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As a member of JGC Group, JFC challenges the possibilities of the material of fine ceramics with our own technologies. We actively engage in fundamental and applied research on ceramics, product application development, as well as manufacturing and sales. We respond to the diverse needs of various advanced industries with our unique technologies and products, including high-frequency ceramic substrates and circuit components, ceramic parts for industrial machinery, and the prototyping and development of metal-ceramic composite materials (MMC).

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