It is suitable for transporting wafers with warping or those that leak with a suction chuck.
It is suitable for transporting wafers with warping, as well as wafers that leak with suction chucks and thin wafers. The chuck body is made of high-purity alumina ceramics, and only the workpiece suction surface uses porous ceramics. With an average pore diameter of 20μm, it can distribute the suction pressure concentrated in the grooves, which are typically about 1.5mm deep in conventional suction surfaces, thereby minimizing deformation of thin workpieces during suction. Mesh particle sizes can be selected from grades #100, #220, and #400. A conductive Teflon coating treatment can also be applied to the workpiece suction surface.
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basic information
Material: High-purity alumina ceramics Adsorption surface material: Porous ceramics Wafer holding method: Adsorption Thickness: 3mm Mesh particle size: 44–74μm (Grade #220) Average pore diameter: 20μm (Grade #220)
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Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
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