This is a transport chuck for wafers that have been processed on the back side and are not to be contacted.
Since the wafer can be centered during transport, it is suitable for transporting to stages such as drop-in stages. The front and rear directions of the wafer are guided and held by an air cylinder. The wafer is held by clamping the outer circumference without contacting the back surface. By clamping the outer circumference, centering of the wafer is possible. High-speed transport is achievable. The presence or absence of the wafer can be confirmed by the amount of movement of the guide.
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basic information
Material: Chuck body: Ceramics, Aluminum, CFRP Wafer contact part: PEEK Surface treatment: Conductive Teflon coating Utility: Air: For air cylinder drive, 0.09MPa or more (varies by structure)
Price range
Delivery Time
Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
◆We value trust We believe that providing products that satisfy our customers is essential, but first and foremost, we want to establish and cherish trust with our "customers" and "business partners" as the foundation of our management. ◆Heart Recognizing that "heartfelt service cannot be born in a workplace where employees lack a sense of purpose and fulfillment," we aim to create a company where everyone is connected with care, even in a small organization. ◆Speed No matter how good a product is, if it doesn't meet the necessary timing, it is not a good product. ◆Skill With years of experience, accumulated data, and developed technology, we can create products that accurately understand needs. ◆Customer trust and satisfaction We are confident that with the integration of "heart" and "skill," we will ultimately provide satisfaction that makes our customers feel, "I am glad I adopted JEL products."
