It is suitable for transporting wafers with warping or those that leak with a suction chuck.
It is suitable for transporting wafers with warping, as well as wafers that leak with suction chucks and thin wafers. The chuck body is made of high-purity alumina ceramics, and only the workpiece suction surface uses porous ceramics. With an average pore diameter of 20μm, it can distribute the suction pressure concentrated in the grooves, which are typically about 1.5mm deep in conventional suction surfaces, thereby minimizing deformation of thin workpieces during suction. Mesh particle sizes can be selected from grades #100, #220, and #400. A conductive Teflon coating treatment can also be applied to the workpiece suction surface.
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basic information
Material: High-purity alumina ceramics Adsorption surface material: Porous ceramics Wafer holding method: Adsorption Thickness: 3mm Mesh particle size: 44–74μm (Grade #220) Average pore diameter: 20μm (Grade #220)
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Applications/Examples of results
Semiconductor manufacturing equipment, etc.
Company information
◆We value trust We believe that providing products that satisfy our customers is essential, but first and foremost, we want to establish and cherish trust with our "customers" and "business partners" as the foundation of our management. ◆Heart Recognizing that "heartfelt service cannot be born in a workplace where employees lack a sense of purpose and fulfillment," we aim to create a company where everyone is connected with care, even in a small organization. ◆Speed No matter how good a product is, if it doesn't meet the necessary timing, it is not a good product. ◆Skill With years of experience, accumulated data, and developed technology, we can create products that accurately understand needs. ◆Customer trust and satisfaction We are confident that with the integration of "heart" and "skill," we will ultimately provide satisfaction that makes our customers feel, "I am glad I adopted JEL products."
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