Supporting everything from tiny components to large BGAs! Introducing our achievements in WLCSP (Wafer Level Chip Size Package) rework.
Here is an introduction to a case where we received a request for WLCSP rework. WLCSP (Wafer Level Chip Size Package) is a package size equivalent to a bare chip called a die, and is considered one of the smallest levels in semiconductors. The requested component also has an outer dimension of 1.5mm and a pitch of 0.4mm. This time, we replaced the part that had been coated with a preservative, ensuring that there were no remnants left behind during the work. [Case Overview] ■ Content: Replacement of the part coated with a preservative ■ Outer Dimension: 1.5mm ■ Pitch: 0.4mm *For more details, please download the PDF or feel free to contact us.
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At Higashi Electronic Industry Co., Ltd., we have been dedicated to creating quality products since our founding, engaging in electronic component assembly, soldering, and mass production. Currently, with the expansion into overseas markets, new needs and wants have emerged that were unimaginable within Japan alone. We believe that listening to these demands and responding swiftly will lead to our future growth.