An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.
We would like to introduce a case study regarding the issue we addressed with "terminals for wire bonding." The customer company was facing difficulties in connecting a metal module board and a motherboard stacked in two layers using wire bonding and was looking for a good solution. We used a special pin header with a flat section to wire bond the metal board to the flat section of the pins, and after attaching the metal module board to the motherboard, we soldered it. 【Case Overview】 ■ Customer's Concern - They wanted to connect a metal module board and a motherboard stacked in two layers using wire bonding. ■ Solution - We wire bonded the metal board to the flat section of the special pin header and soldered the metal module board to the motherboard after attachment. *For more details, please download the PDF or feel free to contact us.
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