Diode module "DCA200/240DB"

For applications such as generators and elevators! The synergy with solder bonding on both sides of the chip improves long-term reliability.

The "DCA 200/240DB" is a high heat dissipation, high reliability model of diode module. By improving heat dissipation through a newly designed low-layer structure and significantly reducing thermal stress on the chip, it achieves approximately twice the power cycle endurance compared to our conventional products. This contributes to the enhancement of device reliability. Additionally, we offer the "DCA200DB220," which uses a specially designed glass passivation type high voltage chip, and the "DCA240EB," which incorporates high heat dissipation special materials in the internal insulation layer. 【Features】 ■ Achieves high heat dissipation (low thermal resistance) through a low-layer structure ■ Realizes a 20% reduction in weight through optimization of internal design and materials (compared to our conventional products), contributing to the lightweighting of devices ■ All models use environmentally friendly completely lead-free solder *For more details, please download the PDF or feel free to contact us.

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