Achieving surface treatment similar to vacuum RIE under atmospheric pressure! Atmospheric pressure plasma system.
SSC-AP Series
【Exhibition Participation!】Ideal for surface modification of BGA substrates and lead frames! Achieves processing effects close to vacuum RIE plasma through the adoption of a unique system!
Our atmospheric pressure plasma system, utilizing a unique design, enables Ar plasma treatment that was difficult to achieve with conventional atmospheric pressure methods, allowing for stable discharge. Additionally, ozone generation is significantly suppressed. Furthermore, by adopting a direct plasma method, we have achieved treatment effects comparable to vacuum RIE plasma. We can propose systems tailored to your desired processing format, such as magazine-to-magazine for lead frames, roll-to-roll, and sheet processing models. Please feel free to contact us. 【Main Effects】 - Surface activation - Organic material removal - Nano-etching 【Examples of Applications】 - Surface modification of semiconductor lead frames before wire bonding - Cleaning of BGA substrates - Cleaning of film surfaces - Surface modification of assembly-related components *We also offer sample demonstrations at our factory and can provide demo equipment for loan. Please feel free to contact us.
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basic information
- Surface treatment close to vacuum RIE is achieved under atmospheric pressure conditions. - We can propose systems tailored to customer requests, such as automated machines. - Live demonstrations will be held at InterNepcon from January 21 (Wednesday) to January 23 (Friday), 2026, at Tokyo Big Sight. - Booth location: East Hall 4 E3-39 *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.

