SINTRONES, equipped with AMD Ryzen Embedded R2312 CPU, extended temperature support, fanless, for automotive use.
**[SINTRONES VBOX-3123-R2312 Features]** ■ Dimensions: 210mm (W) x 56mm (H) x 171mm (D) / Weight: 1.8Kg ■ AMD Ryzen Embedded R2312 2C/4T CPU, fanless operation ■ 1x SO-DIMM DDR4-2400 (up to 32GB) ■ 4K resolution support, 3 display outputs (1 DVI-D, 2 HDMI) ■ 1x M.2 3042/52 Key B (USB 3.2 WWAN with Dual SIM) expansion slot ■ 1x M.2 2230 Key E (PCIe, USB 2.0 Wi-Fi/BT) expansion slot ■ 2x mPCIe full-size slots (supports USB 2.0) ■ 2 GbE (RJ45), 2 USB 3.2 Gen 2 (10Gbps), 2 USB 2.0, 4 RS-232/422/485, 4 DI / 4 DO ■ Extended temperature support -40 to 60°C (SSD, airflow, 0.6m/s) ■ Wide DC input 9-60V, controlled by ignition key ■ Internal battery UPS can be installed (optional) ■ Vehicle standard E-Mark certification
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basic information
Specifications ■CPU: AMD Ryzen Embedded R2312 2C/4T CPU ■Memory: 1 SO-DIMM DDR4-2400 (up to 32GB) ■Storage: 1 M.2 2280 Key M (NVMe or SATA SSD), 1 2.5” SATA SSD ■I/O Connectors: 2 GbE (RJ45), 2 USB 3.2 Gen 2 (10Gbps), 2 USB 2.0, 4 RS-232/422/485 (COM4 optional for CANBUS), 4 DI / 4 DO, 1 DVI-D, 2 HDMI ■Wide DC Input 9–60V, controlled by ignition key ■UPS internal battery (10min) option ■Extended temperature support -40–60℃ (SSD, airflow present, 0.6m/s) ■Certifications: CE, FCC Class A, UKCA, E-Mark
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Applications/Examples of results
For vehicle-mounted, machine, factory, and building automation/monitoring systems.
Line up（1）
| Model number | overview |
|---|---|
| VBOX-3123-R2312 | AMD Ryzen Embedded R2312 w/ 1x DVI-D / 2x HDMI / 2x GbE / 4x COM / DC 9~60V In-Vehicle Computer |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.