Exhibition January 2025: List of Exhibited Products for the 39th Nepcon Japan
We will introduce the products that will be exhibited at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight).
We will exhibit the following products at the 39th Nepcon Japan from January 22 to January 24 (Tokyo Big Sight): 1. Electroless plating "Metapian" 2. Metapian + LCP 3. Heat-resistant molecular gradient film "200Y" and heat-resistant adhesive film "SB Sheet" 4. Dicing tape "RMGU" 5. Back grind tape "214D" 6. Tape for die bonding and assembly processes "170 Series"
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1. Electroless plating "Metapian" 2. Metapian + LCP 3. Heat-resistant molecular gradient film "200Y" / Heat-resistant adhesive film "SB Sheet" 4. Dicing tape "RMGU" 5. Back grind tape "214D" 6. Die bonding and mounting process tape "170 series"
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Functional films and tapes used for masking, protection, transport, mounting, and heat dissipation in semiconductor backend processes.
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Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials, including construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.
