We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
Takaya Corporation will exhibit a corporate booth at the 39th Spring Conference of the Japan Institute of Electronics Packaging, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Institute of Electronics Packaging, where the latest research and development results related to electronics packaging technology are presented and information is exchanged. Since 2023, it has been conducted in a hybrid format, allowing both in-person participation and online attendance, attracting around 700 participants, primarily from academia and industry related to electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
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Dates: March 11 (Tuesday) - 13 (Thursday), 2025 Venue: Takushoku University Bunkyo Campus (3-4-14 Kohinata, Bunkyo-ku, Tokyo) & Online Organizing Office: Electronics Packaging Society (Incorporated Association) 3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042 TEL: 03-5310-2010
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Company information
Founded in 1894 as a textile company, Takaya Textile expanded and established its electronics division in 1966, beginning the assembly of transistor radios. Currently, in addition to contract manufacturing services (EMS) related to electronic devices, the company actively manufactures and sells in-circuit testers (printed circuit board inspection devices), RFID-related equipment (technology that enables information exchange through short-range wireless communication from IC information tags), and engages in IT consulting and system solutions, among various electronics businesses both domestically and internationally. We will continue to evolve as a corporate group that contributes to the development of society, with textiles and electronics as our two pillars.