Use semiconductor silicon wafers for small paths! You can use them just like graphite materials.
"SKC-17" is a compression-molded plate made from carbon powder and thermosetting resin, designed to match the strength characteristics of Chinese-made graphite materials. It has a density of 1.63, a bending strength of 14 MPa, and a bending modulus of elasticity of 3.65 GPa, and is used for small-diameter semiconductor silicon wafers. This plate is intended for customers who manually remove wafers from the plate after processing. 【Key Characteristics】 ■ Main Component: Synthetic graphite powder as the main component + unsaturated polyester resin ■ Manufacturing Method: Compression molding ■ Bending Strength: 14 MPa ■ Bending Modulus of Elasticity: 3.65 GPa *For more details, please download the PDF or feel free to contact us.
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Our company manufactures and sells resin plates (resin beam plates) used for cutting processes of silicon wafers, oxide wafers, rare earth magnets, and more. We carry out all processes from molding to processing using our uniquely formulated resin molding materials, providing beam plates for cutting processes compatible with diamond wire saws, outer blades, inner blades, and multi-wire saws. We aim to maximize the potential of resin composites made from plastics and fillers to contribute to society.