Beam Plate "SKB-13"

For semiconductor silicon wafers and the like! Compatible with heat adhesives (such as shellac resin).

"SKB-13" is a plate primarily composed of aluminum hydroxide and unsaturated polyester resin. It has excellent workability and a material composition that suppresses the heat generated during processing. It effectively reduces wire breakage and clogging of cutting tools such as wires, making it suitable for wire saws, inner blades, and outer blades. Additionally, it has been redesigned to address the common issue of warping in general resin plates after heating, resulting in a plate that is less prone to warping even after heating and cooling. 【Features】 ■ Excellent workability ■ Low water absorption ■ Less prone to warping even after heating and cooling ■ Compatible with hot adhesives ■ Reduces wire breakage and clogging of cutting tools *For more details, please download the PDF or feel free to contact us.

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