ADLINK, DLAP series for Edge AI, equipped with NVIDIA Jetson AGX Orin, fanless feature.
【ADLINK DLAP-411-Orin Features】 ■ Dimensions: 175mm wide × 85mm high × 145mm deep, 2.16 liters ■ DLAP-411-Orin (200TOPS): 8-core Arm Cortex-A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3 NVIDIA Ampere architecture with 1792 NVIDIA CUDA cores and 56 Tensor Cores ■ DLAP-411-Orin (275TOPS): 12-core Arm Cortex-A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3 NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores ■ I/O Connectors: 1 HDMI, 4 GbE, 4 USB3.2, 1 Type C USB3.2 OTG, 1 COM ■ Internal Expansion Slots: M.2 B Key 3052/3042, M.2 E Key 2230 ■ Expansion Storage: M.2 M key 2280/2242
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Specifications - Memory: 32GB 256-bit LPDDR5 / 64GB 256-bit LPDDR5 - Storage: 64GB eMMC 5.1, 1xM.2 2280/2242 (Key M), 1x MicroSD Card - Expansion Slots: 1xM.2 3052/3042 (Key B), 1xM.2 2230 (Key E) - IO Interfaces: 1 HDMI, 4 GbE, 4 USB3.2, 1 Type C USB3.2 OTG, 1 COM, 1 CAN bus (2.0b), Expansion I/O: GPIO, I2C, 2 SPI (DB-26), Audio Mic in, Line out - Input Power: DC 24V input (Optional 220W/160W AC adapter) - Operating Temperature: -20 to 60℃ (200TOPS) / -20 to 55℃ (275TOPS) - Mounting: Wall mount, VESA DIN rail (optional)
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※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
Machine, factory, building automation
Line up(3)
Model number | overview |
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DLAP-411-Orin(200TOPS) | NVIDIA Jetson AGX Orin CPU, 32GB LPDDR5 memory, 64GB eMMC5.1 |
DLAP-411-Orin(275TOPS) | NVIDIA Jetson AGX Orin CPU, 64GB LPDDR5 memory, 64GB eMMC5.1 |
Options | M.2 industrial SSD (NVMe) 1TB/512GB/256GB/128GB, Wi-Fi module, wall mount kit, 220W/160W industrial AC adapter |
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.