No metal mask required. Non-contact high-speed solder application! Compatible with various liquids, including SMT adhesives.
The "MY700" is a solder printing device that does not use a metal mask. By connecting it to existing metal mask printing devices and using our product to print solder only in necessary areas, we aim to improve the efficiency of component mounting and enhance productivity. Since there is no need to create a metal mask for prototype applications, we enable the introduction of new products efficiently and quickly, while simultaneously achieving cost reduction. 【Features】 ■ Efficient production preparation: Start production by simply selecting the printing program ■ Selection of suitable production methods - Compatible with cavity substrates, applying solder to uneven areas - Compatible with inserted components, applying solder around and on top of holes, and supporting assembled substrates *For more details, please download the PDF or feel free to contact us.
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【Other Features】 ■ Add-in to existing lines is also possible ・Compatible with various liquid agents, including SMT adhesives ・Maintains quality and reduces defective products through re-soldering after squeegee printing *For more details, please download the PDF or feel free to contact us.
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We handle various inspection and analysis equipment, including new and used devices. (Fully automatic XPS film thickness concentration measurement device, overlay accuracy measurement device, double-sided coordinate measurement device, film thickness measurement device, ellipsometer, optical three-dimensional measurement device, wafer edge inspection device, transparent wafer front and back defect inspection device, appearance inspection device, optical microscope, exposure device)