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  6. Low dielectric resin filler for additives in semiconductor packaging and assembly materials.

Low dielectric resin filler for additives in semiconductor packaging and assembly materials.

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Tech Polymer

last updated:Mar 15, 2025

積水化成品工業
積水化成品工業
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It is a resin filler with low dielectric properties, an additive that meets the requirements of Dk 3.0 and Df 0.002 or lower for 5G and 6G.

We offer a lineup of hollow types (non-foamed) with excellent low dielectric constant and solid types that consider handling properties. 【Intended Applications】 Additives for materials in semiconductor packaging and mounting fields. 【Product Lineup】 Particle Structure: Hollow Type Particle Structure: Solid Type For information on composition, particle size, hollow ratio, apparent density, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation. 【Customization Examples】 Coarse particle cutting Hollow ratio adjustment Surface treatment Flame retardancy improvement

    plastic
多分散粒子リサイズ.png

Low dielectric resin filler for additives in semiconductor packaging and assembly materials.

多分散粒子リサイズ.png
多分散粒子リサイズ.png
  • Product HP【Tech Polymer】
  • Special site - Product/service details - https://pr.mono.ipros.com/tech-p/product/

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basic information

Low dielectric resin filler Tech Polymer has begun proposals for low dielectric applications aimed at reducing transmission loss in high-frequency regions. We are conducting product proposals leveraging our high customization capabilities, so please feel free to contact us if you are interested. For more details, please inquire through the Ipros link or our company website. (If you are contacting us through our website, please mention that you have viewed the product page on Ipros.) Our website: https://www.tech-p.com/ 【Related words】Organic microparticles / Polymer microparticles / Micronized powder / Beads / Filler / Powder / Dielectric constant / Dielectric loss tangent / Substrate / Copper-clad laminate

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Applications/Examples of results

【Examples of Applicable Fields】 - Semiconductor packages - Mounting fields - Substrates - Copper-clad laminates, etc. 【Functionality Enhancement】 - Low dielectric - Flexibility, etc.

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Low dielectric resin filler for additives in semiconductor packaging and assembly materials.

Low dielectric resin filler for additives in semiconductor packaging and assembly materials.

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Publication of Tech Polymer Product Information! Introduction of Low Dielectric Resin Fillers.

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We have newly created a product page for the Tech Polymer "Low Dielectric Resin Filler"!! This is an additive with low dielectric properties, meeting the requirements of Dk 3.0 and Df 0.002 or lower for 5G and 6G applications. We offer a lineup of hollow type (non-foamed) with excellent low dielectric rate and solid type considering handling properties. 【Intended Applications】 Additives for materials in semiconductor packaging and mounting fields. 【Product Lineup】 Particle Structure: Hollow Type Particle Structure: Solid Type For information on composition, particle size, hollow ratio, apparent density, dielectric properties (Dk, Df), and heat resistance, please download the materials for confirmation.

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積水化成品工業

積水化成品工業

Chemical

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Sekisui Chemical Co., Ltd. handles functional polymers (fine particles). We propose a unique solution by combining multiple functions and technologies. Additionally, our proprietary polymerization technology has developed tech polymers that come in a wide variety of grades to meet diverse needs. Customization of fine particles is possible according to your requirements. We can adjust particle size, particle size distribution, solvent resistance, heat resistance, refractive index, and more, so please feel free to contact us. <Our website has been renewed>

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