High dielectric constant & low dielectric loss tangent printed circuit board materials
Rishoraito
Proposal for the miniaturization of millimeter-wave antennas.
This is a printed circuit board material with high dielectric constant (Dk=11.3) and low dielectric loss tangent (Df=0.003). It is a type reinforced with glass cloth using PPE resin (polyphenylene ether), allowing the use of existing machinery and know-how for processing glass epoxy type printed circuit boards (FR-4). We also have prepreg for multilayering (ES-3346) and interlayer adhesive sheets (AD-3396).
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basic information
1. High dielectric constant / Dk=11.3 (@1GHz) 2. Low dielectric loss tangent / Df=0.0030 (@1GHz) 3. Good handling with a bending modulus of 14 GPa 4. Low water absorption (0.02%, thickness 1.6mm) 5. Thermal conductivity = 1 W/mK (more than three times that of standard FR-4) 6. Excellent for drilling processing (equivalent to standard FR-4) 7. Existing processing machines and know-how can be utilized 8. Items prepared for multilayer or lamination use
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Applications/Examples of results
- Miniaturization of high-frequency components such as antennas and sensors - Component-integrated substrates
Line up（3）
| Model number | overview |
|---|---|
| CS-3396 | Copper-clad laminate (CCL). Dk=11.3 / Df=0.003. While ceramic substrates are mainstream for millimeter-wave antennas, they are hard and brittle, requiring advanced technology to cut them into sizes and shapes that fit smartphone housings. On the other hand, CS-3396 can be cut using standard printed circuit board material processing machines. |
| ES-3346 | Prepreg for multilayering. When multilayering high-frequency substrates, this single sheet allows for simultaneous insulation between layers and adhesion between layers without spoiling dielectric properties. |
| AD-3396 | Interlayer adhesive sheet. When embedding components within printed circuit boards, it serves the role of both insulation layer and adhesive. It is provided in a semi-cured state, thinly stretched to about 0.1mm using only high-dielectric resin, sandwiched between release films. Since it does not contain glass cloth, its characteristics are further enhanced with Df=16.5 (1GHz). |
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.