Realization of high quality and high stability through patented technology.
The "Smart Dip II FXM-2" is an inline model of the automatic soldering device from the "Smart Dip Series," which achieves high quality and high stability. It uses a stirring mechanism (our patented technology) to generate waves, promoting heat exchange and performing soldering. This maintains the advantages of reduced oxidation in the stagnant tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow velocity of the generated waves, this method is less likely to cause copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Possible reduction in daily maintenance time ■ Lower running costs due to minimal oxidation generation *For more details, please feel free to contact us.
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【External Dimensions】 1,200(W)×4,996(D)×1,400(H)mm 【Device Weight】 From input to fluxer: approximately 200kgf / From preheater to outlet: approximately 1,300kgf 【Work Size】 Pallet external dimensions 380(W)×350(D)mm / Substrate external dimensions 330(W)×250(D)mm 【Solder Tank】 Stainless steel (nitrided) 【Solder Capacity】 Approximately 270kg 【Preheater】 IR panel heater (4 zones) 【Number of Registered Models】 999 models
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FA Shinka Technology Co., Ltd. designs, manufactures, and sells automatic soldering equipment and related assembly equipment. Our devices, which pursue stability in quality and ease of use through proprietary patented technology, have become the foundation of manufacturing worldwide, both domestically and internationally.