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  5. Electron tube
  6. Achieving cost reduction for silver paste! Proposing an alternative to silver through plating.

Achieving cost reduction for silver paste! Proposing an alternative to silver through plating.

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last updated:Feb 17, 2025

東洋アルミニウム
東洋アルミニウム
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Great news for the electronic components industry! We have achieved a significant reduction in costs by reducing the amount of silver used while ensuring conductivity, using conductive silver-plated fillers.

Silver, which is widely used in pendants, necklaces, and decorative items, has also been used for high-end tableware and spoons for a long time. Did you know that this "silver" is also extensively used in the field of electronic components? Silver is known for its excellent conductivity and is used in large quantities as a conductive filler in electronic components and as a material for solar power generation. The price of silver continues to rise, and the components that use silver are also experiencing soaring prices, leading to a strong demand for cost reduction. Our conductive silver plating filler, "TecFiller TFM Series," uses inexpensive materials such as copper and silica powder as the core material and achieves significant cost reduction by "plating silver only on the surface," ensuring conductivity while reducing the amount of silver used. The "TecFiller TFM Series" not only contributes to achieving the SDGs but also "helps our customers reduce costs."

    Electron tubeCircuit board design and manufacturing
TecFiller写真.PNG

Achieving cost reduction for silver paste! Proposing an alternative to silver through plating.

TecFiller写真.PNG
TecFiller写真.PNG
  • Special site - Product/service details - https://pr.mono.ipros.com/toyal/product/

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TFM Series

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Conductive adhesive Conductive ink

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Do you know about conductive silver plating fillers?

Do you know about conductive silver plating fillers?

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What is a filler that you can't ask about now?

What is a filler that you can't ask about now?

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Technical Report: Conductive Fillers Using Powder Coating Technology

Technical Report: Conductive Fillers Using Powder Coating Technology

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Conductive Adhesive TCB Series

Conductive Adhesive TCB Series

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【Technical Data】 Powder Coating Technology 'TOYAL Techfiller'

【Technical Data】 Powder Coating Technology 'TOYAL Techfiller'

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東洋アルミニウム

東洋アルミニウム

Ferrous/Non-ferrous metals

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Toyo Aluminum K.K. has been pursuing the potential of aluminum's functionality and design since its founding, developing useful products and contributing to society. By accurately responding to customer needs based on the characteristics of aluminum and research outcomes, we produce foil products tailored to applications in packaging, electronics, and daily necessities, as well as powder and paste products as high-performance materials, and solar cell-related products that consider the global environment. We have grown into a manufacturer that operates globally, not only in Japan but also in Europe, the Americas, China, and other Asian countries. Moving forward, we will leverage our unique core technology as a source of development strength, under the action policy of "Creating the future, I create, we all create," to meet customer demands and contribute to the development of a new society.

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  • Electronic Components and Modules
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