Area productivity increased by 15%! Maintaining substrate compatibility with a maximum size of 380×460 allows for diverse production.
The "ULTIMA-NEO-L Smart" is a selective soldering device that has achieved miniaturization compared to the conventional model NEO-L. The reduction in size has led to a 10% decrease in power consumption. The spray and solder pot have been consolidated into one unit, improving convenience. Additionally, easy data creation is possible (anyone can do it). It can be equipped with the new feature "Preheating Unit IPH" (optional). 【Specifications (excerpt)】 ■ Device dimensions: 1150(L)×1250(W)×1050(H)mm ■ Board size: 50(W)×50(L) to 380(W)×460(L)mm ■ Maximum board weight: 2kg ■ Component height: Upper 50mm, Lower 25mm (or less) ■ Air supply volume: 0.4-0.5MPa 50L/min *For more details, please download the PDF or feel free to contact us.
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【Options (Excerpt)】 ■ Circuit board warping correction mechanism ■ Production log management application (used with occupancy sensors) ■ Barcode and QR code compatible automatic model switching application (excluding readers) ■ Teaching camera (with simulation function) ■ Safety cover (front/top area sensors and exhaust duct) *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
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