Overcoming the challenges of soldering: "IH Soldering Device" [Case Study]

Since it heats metal non-contact, soldering is possible even with a "4mm" wall terminal! We will also introduce examples of achieving soldering on a 6-layer thick copper substrate.

The IH soldering device "S-WAVE" has a magnetic concentration head tip that remains below 100°C, while only the terminals can rise to 250°C, allowing for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have increased in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Cases" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Cases" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the advantages of the WAVE series IH soldering, making it easy to reference when considering implementation. **Advantages of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

Solder