Silicon wafer dicing processing is being performed.
Mainly, we perform drilling processing for wafer inch-down.
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Makino Milling Machine Co., Ltd. Machining Center
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Our company specializes in precision processing of silicon, ceramics, quartz, alumina, glass, silicon wafers, and semiconductor compounds using advanced technology and know-how. Additionally, through the manufacturing and sales of wrapping materials and auxiliary materials, we significantly contribute to the development of the electronics industry.