Achieving high precision in wire processing for electronic devices.

We accelerate product development with short delivery times and high-quality wire processing.

In the manufacturing of electronic devices, parts that require complex shapes or fine processing can be difficult to achieve with conventional machining methods. Therefore, wire electrical discharge machining (wire cutting) is gaining attention. Since it cuts by melting the metal, there is no generation of burrs. The cross-section is also smoother and more vertical compared to laser or press machining. At Kuroda Seiki, we provide high-precision and high-quality wire cutting services supported by our extensive facilities and advanced technical capabilities, strongly assisting our customers in product development. 【Application Scenarios】 - Semiconductor manufacturing equipment parts: Ideal for processing semiconductor manufacturing equipment parts that require fine machining. - Medical device parts: Ideal for processing medical device parts that require precise or complex shapes. 【Benefits of Implementation】 - Improved product quality: High-precision machining contributes to enhancing product quality. - Accelerated product development: By achieving short lead times for machining, we contribute to speeding up product development. - Cost reduction: Compared to conventional machining methods, machining time can be shortened, contributing to cost reduction.

Processing ContractPrototype Services